This time I found it difficult to find a suitable subject for my editorial. My original idea was to write about heat spreading, again. I found some interesting facts pointing at problems of interpretation for…read more
Thermal Facts and Fairytales: Does Your Correlation Have an Imposed Slope?
September 8th, 2011
There must be an ideal world A sort of mathematicians’ paradise Where everything happens As it does in textbooks — Bertrand Russell This is the third column devoted to the sense and nonsense of correlations.…read more
Lab-on-a-Chip Thermal Management Solutions
June 13th, 2011
Microelectronics and microsystems play a vital and increasingly important role in current and future human life and society. The future will bring a plethora of new products/processes based on new concepts with limited past experience…read more
Thermal Facts and Fairy Tales: Published Thermal Conductivities Values: Facts or Fairy Tales?
March 2nd, 2011
Around 1980, when I joined the Heat Transfer Group at Philips CFT, my boss threw a piece of material on my desk and asked for its thermal conductivity. It took me a week digging in…read more
editoral: why standardization is mandatory: on the incorrect use of thermal impedance in the TIM world
September 13th, 2010
Clemens J.M. Lasance Editor-in-Chief, Fall 2010 Issue Some time ago I devoted my editorial to the problems caused by the veeerrryyy slow adherence to the use of SI units to which the U.S. committed itself…read more
thermal facts and fairy tales: fully-developed channel flow: why is Nu constant?
September 13th, 2010
Clemens J.M. Lasance Philips Research Laboratories Emeritus The last time the subject of my column was: ‘Most of us don’t live in wind tunnels, neither in the world of Nusselt.’ I promised more comments about…read more
thermal facts and fairy tales: most of us live neither in wind tunnels nor in the world of Nusselt
April 30th, 2010
Having read myriad papers/articles/books/reports on thermal management, I feel there is a lot of misunderstanding about what really should drive a sound approach of how to tackle the thermal problems that tend to land on…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
On (the Lack of) Thermal Education
May 1st, 2009
Some like it hot, others do not. And those others for sure include the designers of products that contain electronics. There is a growing need to educate designers who are involved with the undesired side-effects…read more
Thermal Conductivity of Filled Plastics
May 1st, 2009
Compared to other solid materials, metals are widely known for their superior heat transfer capabilities. However, these capabilities come at the cost of weight, coefficient of thermal expansion (CTE) mismatch and freedom of design due…read more
Emissivity in Practical Numerical Modeling
November 1st, 2008
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the…read more
On The Hate/Love Relationship Between The U.S. And SI
May 1st, 2008
Last year I devoted some words on correligion: the religious belief in the usefulness of correlations to solve real-life problems. I forgot to mention that correlations have one big advantage; they are dimensionless meaning that…read more
Heat Spreading: Not a Trivial Problem
May 1st, 2008
Introduction Heat spreading is essentially area enlarging: the larger the area, the more heat can be removed at the same temperature difference (subject to certain limits). Unfortunately, except for the simplest of cases, the equations…read more
Recent Posts
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- Look for the March issue of Electronics Cooling featuring the 2012 Buyers' Guide - Subscribe today - http://t.co/RGtouuDk #
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
