Thermal Simulation Software Named Product of the Year

April 24th, 2015

Future Facilities’ thermal simulation software, the 6SigmaET R9, has been chosen as product of the year at the Engineering Simulation Show 2015. Judges awarded the prize for the software being “easy to use, powerful and intuitive”…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Scientist Uses Virus to Slow Down Water Boiling; Improves Cooling of Electronics

April 14th, 2015

Matthew McCarthy, Ph.D., a scientist from Drexel University, has discovered the process of boiling water can be sped up with aid of a virus. McCarthy realized improvements are not made to the surface used to…read more

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Startup Utilizes Waste Heat and Lowers Server Computing Costs

April 14th, 2015

Nerdalize, a Dutch startup company, wants to utilize waste heat generated from servers to heat homes for free. The company offers “eRadiators,” which are high-performance servers that also act as radiators. The company plans to…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

Thermoelectric Coolers Ideal for Cooling Mobile Devices in All Environments

April 13th, 2015

EIC Solutions Inc. introduces a product line of Auto-ranging (M105) Thermoelectric Air Conditioners. The ThermoTEC 141, 145 and 151 series have auto ranging power capabilities. The auto ranging feature is ideal for cooling mobile devices…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

Summary of ‘Thermal Interface Materials Predictions 2015-2025’

April 7th, 2015

A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.  “The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated…read more

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Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

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Low Cost Louvered Fan Guards Introduced

April 6th, 2015

Orion Fans expands its fan accessories to include the lowest-cost louvered fan guards in the industry. The fan guards are ideal for use in 80, 92, 120, 172, 225, 254 and 280mm AC fans. Fan…read more

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Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

Heatsink 101: Everything You Ever Wanted to Know Web Seminar

March 26th, 2015

Wednesday, April 1, 2015 2:00 PM – 3:00 PM US/Eastern Online Event This web seminar focuses on how heatsinks work and how to design a heatsink while considering all the critical factors such as size,…read more

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Liquid Cooling in Mobile Devices Increases Heat Dissipation Speeds

March 24th, 2015

Fujitsu Engineers have reportedly discovered a better way to dissipate heat from mobile devices. By using liquid cooling, heat dissipation occurs five times faster than current dissipation methods. “It’s built a microscale heat pipe, less…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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