Applications

BIG Thermal Test for the JWST Test Model

April 25th, 2016

(April 22nd, 2016) The James Webb Space Telescope had an “observatory core” test model twin of itself constructed for the biggest thermal test Goddard mechanical integration technician, Chris Matthews, has ever had. Matthews’ team of…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

Posted in Aerospace, Automotive, Computer, Coolers, Defense, Materials, Compounds, Adhesives, Substrates, Medical, News, Semiconductor | Comments Off on Potential Electronics Cooling Application of Carbon Nanotubes

Thermal Innovations Win Award and Industry Recognition

April 25th, 2016

(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the…read more

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New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

Posted in Computer, Data Centers, Heat Pipes, LED / Lighting, New Products, Refrigeration | Comments Off on New Website for Unique Product Line

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

Posted in Computer, Consumer, Enclosures, New Products, Software/Modeling | Comments Off on New System Improves Lead Times

Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

Posted in Computer, Coolers, Design, Design, Heat Exchanger, Heat Pipes, News, Research | Comments Off on Metal Inverse Opals Could Better Cool Electronics

New Approach to Simulate Nanoscale Thermoelectric Materials

April 18th, 2016

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials,…read more

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Small EHD Pump Solution May Cool Space Hardware

April 18th, 2016

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the…read more

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Enhanced Two-Phase Impingement Technologies for Electronics Cooling

April 14th, 2016

  Enhanced Two-Phase Impingement Technologies for Electronics Cooling Matthew J. Rau*, Ercan M. Dede†, Shailesh N. Joshi† *School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, IN 47907 USA †Electronics Research Department, Toyota…read more

Posted in Articles, Liquid Cooling | Comments Off on Enhanced Two-Phase Impingement Technologies for Electronics Cooling

Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices

April 14th, 2016

Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices Thomas Obeloer*, Bruce Bolliger Element Six Technologies 3901 Burton Drive, Santa Clara, CA 95054 *thomas.obeloer@e6.com   Yong Han, Boon Long Lau, Gongyue Tang,…read more

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iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

Posted in Articles, Design, Heat Pipes, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, TIMs | Comments Off on iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

April 14th, 2016

Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era…read more

Posted in Articles, CFD Software, Computer, Liquid Cooling, Software/Modeling, Test & Measurement | Comments Off on Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers