Company Raises Funds to Pursue New Market Opportunities and Cooling Solutions

January 13th, 2015

Phononic announces it has raised $44.5 million dollars to develop solid-state cooling solutions for refrigeration and electronics cooling. Phononic’s approach to cooling and heating involves using solid-state technology to provide thermal management solutions. “The company…read more

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Unnamed Product Acts as Both Heatsink and CPU Fan

January 13th, 2015

Typically, heatsinks and CPU Fans can be very large which limits configuration possibilities in the hardware. CoolChip Technologies has solved this problem by introducing a new kinetic cooler with physical restraints that are easier to work…read more

New Epoxy Offers Low Coefficient of Thermal Expansion

January 12th, 2015

Master Bond announces its EP42HT-2LTE, a two part room temperature curing epoxy. This epoxy is ideal for use in bonding, sealing, coating and casting applications in the aerospace, electronic, optical and specialty OEM industries. The…read more

Wide Operating Temperature Range Fan Introduced

January 12th, 2015

Sanyo Denki launches its new wide temperature range fan with an industry-leading operating temperature range of -40 to +85 degrees Celsius. Features of this product include an expected life of 40,000 hours, a 90 percent…read more

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Need for Heat Spreaders Yields New Cooling Technologies

January 6th, 2015

The Air Force Research Laboratory (AFRL) and a small business partner have announced they are developing technologies that will help electronics stay cool. With funding from the Air Force Small Business Innovation Research (SBIR) program,…read more

Expansion of Fan Tray Offerings Includes Six Fan Positions

January 5th, 2015

Orion Fans, a division of Knight Electronics, Inc. introduces a high airflow fan tray with redundant power – the OA406 Series. The OA406 Series, which is RoHS compliant and offers high performance, is ideal for…read more

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Research Group at U-Michigan Develops Heat-conducting Plastic

December 16th, 2014

A research team from the University of Michigan has developed a heat-conducting plastic that bends 10 times better than previous materials. Plastic is a favorable material for electronic devices because it is lightweight, flexible and…read more

Bay Light Heatsinks offer Thermal Solutions

December 15th, 2014

GlacialTech Inc. announced its new line of high performance Bay Light heatsinks for high power LED applications. The line of heatsinks includes the Igloo SR100, SR150, SR200, SR200HP and SR250HP. The Igloo SR200HP and Igloo…read more

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Lightweight Push-Pin Heat Sinks offer Advanced Cooling Solutions for BGAs

December 15th, 2014

Digi-Key now offers more than 200 advanced thermal solutions (ATS) heat sinks with push-pin mounting and 108,000 possible configurations. Features of the heat sinks include pre-drilled holes for mounting to PCBs, flexible barbs, compression springs…read more

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Low Consumption Fan Offers High Static Pressure

December 15th, 2014

Sanyo Denki introduces its 9GA type, a low power consumption fan that offers high airflow. The fan only consumes 3.24 W of power, achieves a static pressure of 66 Pa, and achieves maximum airflow of…read more

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Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

‘Tech Tidbit’ – Free Heat Exchanger Technology Successfully Cools Earth

December 9th, 2014

A group of engineers from Stanford University, led by Professor Shanhui Han, have developed a free heat exchanger technology that successfully cools the Earth. The radiator system works by beaming heat and sunlight from buildings…read more

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Company offers Thermoplastic Compounds Solutions

December 9th, 2014

There is a reported global shortage of Polyetherimide (PEI) and RTP Company offers a solution with its thermoplastic compounds as a practical alternative to the polymer. Engineers from RTP Company have produced and modified these…read more

New Thermal Gaskets Easily Transfer Heat

December 9th, 2014

Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more

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