Organic Thin-Film Transistors Now Formed through Room-Temperature Printing

September 9th, 2014

Japanese researchers confirmed a new process for developing organic thin-film transistors (TFTs) while at room temperature. This new process uses flexible materials such as plastic – which will aid in the mass production of future…read more

New Thermoelectric Devices Establish Beneficial Uses for Waste Heat

September 8th, 2014

Researchers estimate that more than half of the energy generated in the U.S from vehicles, machinery and heavy equipment is wasted as heat when it escapes into the air. Gang Chen, the Carl Richard Soderberg…read more

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New Compounds Improve Refrigerant Manufacturing

September 2nd, 2014

Researchers in Singapore have developed a new magnetic refrigerant that is easier to prepare than previous compounds. Magnetic refrigeration has been established as effective in cooling susceptible scientific instruments; however, refrigerants prove difficult to prepare.…read more

New 4G Roaming Technology Must Account for Thermal Loss, Say Researchers

August 26th, 2014

According to Danish researchers, the push towards global 4G roaming and high-quality, frequency-reconfigurable antennas will need to account for new loss capacities not taken into account by previous technology. The worldwide demand for 4G technology…read more

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High Performance Thermal Imaging Camera Meets R&D Requirements

August 26th, 2014

FLIR Systems has introduced the FLIR A65sc, a new high performance thermal imaging camera designed for research and design applications. Capable of visualizing temperatures from -40°C to +550°C with temperature differences as small as 50mK,…read more

Webinar on, “Thermal RC Modeling Using a Spreadsheet”

August 26th, 2014

Overview: In this webinar, we will take a look at thermal analysis and modeling using nothing more than your every-day spreadsheet program. In particular, we will focus on Foster-ladder thermal RC models, including how to…read more

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Webinar on, “Traditional Thermal Materials and Applications”

August 26th, 2014

Overview: Thermal management, which includes heat dissipation and thermal stresses, is a key problem in most electronic and photonic applications. Materials play a key role in meeting thermal requirements. In the previous three presentations in…read more

Webinar on, “Linear Superposition: Tutorial on Thermal-RC Networks”

August 26th, 2014

Overview This 45-minute seminar will show how some basic concepts of transient analysis of linear thermal systems can be applied to a real-world thermal system design. The mathematical concepts utilized will be presented as principles,…read more

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Cold Forged Heat Sinks Boost Thermal Management of LEDs

August 19th, 2014

GlacialTech Inc. has introduced Igloo FR210 and Igloo FR210HP, two new cold forging thermal modules designed for 80W LED thermal management applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for…read more

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Electronics Cooling September 2014 Issue Now Online

August 19th, 2014

Don’t miss out on the September 2014 issue of Electronics Cooling, which includes feature articles on CVD Diamond – Integrating a Superior Thermal Material; An Inexpensive Multi-channel AC Heater Control System; Jet Impingement on Micro Pin…read more

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Laser Cooling Yields More Sensitive Microscopes

August 19th, 2014

By cooling a nanowire probe using lasers, Australian scientists have discovered a way of dramatically improving atomic microscope sensitivity by up to 20 times, allowing them to register forces as small as that of an…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Highly Conformable TIM Line Expanded with 1.0 mm Sheet

August 7th, 2014

Fuijipoly has announced the expansion of its Sarcon XR-Pe thermal interface material line with the availability of a 1.0 mm thick sheet. Requiring low compression force to conform to most CPU and semiconductor shapes, Sarcon…read more

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Cooling Enhancement Boosts Operation of Laser Power Amplifier

August 5th, 2014

By enhancing the cooling system of a thin disk laser power amplifier with an optically-transparent heat sink, researchers at the U.S. Army Research Laboratory have successfully extended the device’s power scaling up to two and…read more

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