Applications

Research Group at U-Michigan Develops Heat-conducting Plastic

December 16th, 2014

A research team from the University of Michigan has developed a heat-conducting plastic that bends 10 times better than previous materials. Plastic is a favorable material for electronic devices because it is lightweight, flexible and…read more

Bay Light Heatsinks offer Thermal Solutions

December 15th, 2014

GlacialTech Inc. announced its new line of high performance Bay Light heatsinks for high power LED applications. The line of heatsinks includes the Igloo SR100, SR150, SR200, SR200HP and SR250HP. The Igloo SR200HP and Igloo…read more

Posted in Heat Sinks, LED / Lighting, New Products | Comments Off

Lightweight Push-Pin Heat Sinks offer Advanced Cooling Solutions for BGAs

December 15th, 2014

Digi-Key now offers more than 200 advanced thermal solutions (ATS) heat sinks with push-pin mounting and 108,000 possible configurations. Features of the heat sinks include pre-drilled holes for mounting to PCBs, flexible barbs, compression springs…read more

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Low Consumption Fan Offers High Static Pressure

December 15th, 2014

Sanyo Denki introduces its 9GA type, a low power consumption fan that offers high airflow. The fan only consumes 3.24 W of power, achieves a static pressure of 66 Pa, and achieves maximum airflow of…read more

Posted in Blowers / Fans / Filters, New Products | Comments Off

Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

‘Tech Tidbit’ – Free Heat Exchanger Technology Successfully Cools Earth

December 9th, 2014

A group of engineers from Stanford University, led by Professor Shanhui Han, have developed a free heat exchanger technology that successfully cools the Earth. The radiator system works by beaming heat and sunlight from buildings…read more

Posted in Free Air Cooling, Heat Exchanger, Heat Sinks, News | Comments Off

Company offers Thermoplastic Compounds Solutions

December 9th, 2014

There is a reported global shortage of Polyetherimide (PEI) and RTP Company offers a solution with its thermoplastic compounds as a practical alternative to the polymer. Engineers from RTP Company have produced and modified these…read more

New Thermal Gaskets Easily Transfer Heat

December 9th, 2014

Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more

Posted in Heat Exchanger, Heat Sinks, New Products, TIMs | Comments Off

Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

Posted in Design, New Products | Comments Off

Thermal Facts and Fairy Tales: Moist Air and Cooling Electronics

December 3rd, 2014

Ambient air is the ultimate heat sink for the majority of electronics thermal management systems and a typical job as a thermal engineer is focused on minimizing the thermal resistance between the electronics and the…read more

Posted in Free Air Cooling, Heat Sinks | Comments Off

Novel Heat Pipe Based Thermal Solutions for Cooling Optical Plug Modules

December 2nd, 2014

Due to rise in both data speed and traffic volume through computers, tablets, and mobile devices, network bandwidth must be continually increased to keep up with the demand. Fiber optic cable is used for high-speed,…read more

Posted in Coolers, Liquid Cooling, Technical Brief | Comments Off

Leakage Power: Physical Mechanisms and Possible Solutions

December 2nd, 2014

Caleb Serafy and Ankur Srivastava ECE Department, University of Maryland, College Park {cserafy1,ankurs}@umd.edu As technology scaling continues to push transistors to smaller and smaller sizes, leakage power has become a significant portion of total power…read more

Posted in Free Air Cooling | Comments Off

Carbon Based Thermal Interface Material for High Performance Cooling

December 2nd, 2014

Ioan Sauciuc, Rei Yamamoto, Jelena Culic-Viskota, Michiaki Yajima Abstract— The focus of this paper is on the development of a novel thermal interface material (TIM) called Vertical Carbon TIM (VCTIM). This composite material consists of…read more

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THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more