Applications

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

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Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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The Holy Books of Heat Transfer: Facts or Fairy Tales?

May 21st, 2015

By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is: both! It all depends on whether or not your situation is truly similar to the situation described in the…read more

Posted in Articles, Heat Exchanger | Comments Off on The Holy Books of Heat Transfer: Facts or Fairy Tales?

Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation under Thermal Duress

May 20th, 2015

By: Chandan K. Roy1, Sushil Bhavnani1, Michael C. Hamilton2, R. Wayne Johnson3, Roy W. Knight1, & Daniel K. Harris1 1 Department of Mechanical Engineering, Auburn University, Auburn, AL 2 Department of Electrical and Computer Engineering,…read more

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New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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A Simple Method to Understand Trade-Offs in Data Center Cooling

May 20th, 2015

By: Dustin W. Demetriou, PhD Cooling and thermal management are critical to data center reliability. Many organizations see cooling as a differentiating factor in the lifecycle cost of their data center. Recent industry guidelines [1]…read more

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Report: Images on Forum Show How Liquid Cooling is Incorporated into New Products

May 12th, 2015

Three images have appeared on an Asian video card forum named Chiphell of new AMD Fiji GPUs, showcasing compact PCBs pre-fitted with a liquid-cooling heatsink and loop connectors. It has not yet been determined if…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

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High Static Pressure Fan Offers 1.4 Times Static Pressure

May 11th, 2015

Sanyo Denki introduces its new San Ace 40 9HV type high static pressure fan. The fan type offers the highest static pressure in the industry – 1.4 times the static pressure than conventional DC fans,…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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New Centrifugal Fan Offers High Cooling Performance

May 4th, 2015

Sanyo Denki has launched its new San Ace C225 ø225 mm x 99 mm centrifugal fan. The fan offers industry leading airflow, static pressure, noise and energy efficiency performance, according to the company. Features of…read more

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Frameless Bracket Fans Offer Design Flexibility

May 4th, 2015

JARO Thermal introduces new fluid bearing, frameless, bracket fans that offer airflow from 3.5 CFM to over 51 CFM. These fans offer numerous mounting options and advanced design flexibility. The fans offer an operating temperature…read more

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