Applications

Graphene Grown From Tea Tree Extract

August 25th, 2015

Scientists have successfully grown high-quality graphene from a tea tree plant known as Melaleuca alternifolia. This plant is commonly used to make oils and medicine. The scientists’ paper has been published in a recent issue…read more

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Atom Cooling Technique Discovered

August 25th, 2015

A team of researchers from the University of Southampton have successfully used matter waves to cool molecules that cannot be handled by typical laser methods. This is the first demonstration of this technique, which was…read more

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Solid-state CPU Cooler Offers Advanced Cooling

August 24th, 2015

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size. “Unlike traditional heatsink/fan…read more

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

August 24th, 2015

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company. The adhesives were…read more

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TIM with EMI Absorption Capabilities Announced

August 24th, 2015

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more

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DesignCon 2016

August 20th, 2015

DesignCon 2016 Jan 19- 21, 2016 Santa Clara, CA DesignCon is the premier conference for chip, board and systems design engineers in the high speed communications and semiconductor communities. It was created by engineers for…read more

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Hong Kong International Lighting Fair

August 19th, 2015

Hong Kong International Lighting Fair October 27 – 30, 2015 Hong Kong, China Organized by the HKTDC and held at the HKCEC, the Hong Kong International Lighting Fair (Autumn Edition) is the largest autumn lighting…read more

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‘Wonder Material’ Graphene: Possible Solution for Energy Storage

August 17th, 2015

Graphene has been suggested as a possible solution in new energy storage techniques, leading researchers to suggest either adjusting Li-ion batteries, or using graphene as an energy storage medium itself. According to the an article…read more

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Electronic Devices Made Faster by Graphene Nanoribbon Technique

August 17th, 2015

Graphene could be used for the next generation of faster, more energy-efficient electronics. According to engineers from the University of Wisconsin-Madison, they have developed “a way to grow graphene nanoribbons with desirable semiconducting properties directly…read more

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Liquid-cooled Primergy Server to Cut Energy Costs in Half

August 12th, 2015

Fujitsu unveiled a new liquid-cooled Primergy server, the Primergy CX400 M1, which will cut energy costs in half and increase density in data centers by five times. “Fujitsu is revolutionizing data center design, and is…read more

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New TIMs for ECUs and Embedded Systems Cooling

August 12th, 2015

Fujipoly America Corporation introduces an assortment of TIMs for commercial and military vehicle ECUs and embedded systems cooling. “The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly…read more

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Partnership Forms to Offer New Liquid-cooling Solutions

August 12th, 2015

Mellanox Technologies and Icetope are partnering to offer liquid-cooled InfiniBand and Ethernet network interconnects for high-performance computing. The companies are combining Icetope’s liquid-cooling technology and Mellanox’s knowledge of high performance networks to produce a “36-port…read more

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Three New Lines of TIMs Offer High Thermal Conductivity

August 12th, 2015

Aavid Thermalloy introduces three new lines of high-performance thermal interface materials – thermally conductive gap fillers. The three lines include the SuperThermal™, SoftFlex™, and WaveBlocker™. These product lines offer very high thermal conductivity without compromising…read more

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Penn State Engineers Developed New Heat-Resistant Polymer

August 11th, 2015

A group of Penn State engineers have produced lightweight, flexible dielectric polymers that are heat resistant and easily manufactured. Because of its resistance to heat, the new polymer is ideal for use in power electronics…read more

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