November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

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Add-on to Existing Product Enhances Thermal Simulation

November 24th, 2014

Harley Thermal LLC has announced its new SolariaPCB, an add-on to Solaria, the company’s thermal simulation software tool.  The SolariaPCB allows quick and easy thermal simulation of printed circuit boards. “The SolariaPCB add-on to Solaria…read more

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Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more

Scientists Produce Beneficial Materials for Optoelectronics

November 24th, 2014

Last month, scientists announced Molybdenum Disulfide MoS2 as a new successor to graphene and better material due to its low electrical resistance, high thermal conductivity and its ability to be stretched. Scientists have just introduced…read more

Graphene Coatings Increase Thermal Conductivity of Plastics

November 10th, 2014

A group of researchers and engineers have discovered that by adding a graphene coating to materials, the thermal conductivity of the materials increases by 600 times. In the group’s experiment, a common plastic called PET,…read more

New TIMs made of Soft Materials

November 10th, 2014

Two students at Texas A&M University, along with assistant professor of chemical engineering, Dr. Mustafa Akbulut, have announced new thermal interface materials they have produced in a project funded by DARPA. These TIMs have “a…read more

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Lab Safety Improved with Quick Disconnect Couplings on Caps

November 10th, 2014

Colder Products Company introduces its BQ45GL series – 45mm caps with integrated quick disconnect couplings, which is a first in the market. “Adding quick disconnects to media bottles enhances the user experience when using laboratory…read more

Plastic Compounds Lower Weight of Automobiles by 50 Percent

November 10th, 2014

RTP Company announces its new thermally conductive compounds that reduce the weight in vehicles by replacing metal in the heating and cooling systems. “The automotive market is putting more emphasis on eliminating metals in order…read more

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New Thermoelectric Air Conditioner Introduced

November 10th, 2014

TECA introduces a new and improved Thermoelectric Air Conditioner, known as the AHP-690.  The AHP-690 is powerful, compact, and offers a 55 percent greater performance in cooling than other products in the industry. Because TECA’s…read more

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Dissolvable Materials Look Toward ‘Greener’ Future

October 28th, 2014

A research group, lead by John A. Rogers, at the University of Illinois at Urbana-Champaign, has produced dissolvable circuits and sensors. These devices are made from silicon and can dissolve completely when immersed in water…read more

Charged Graphene Called ‘Molecular Gymnastics’

October 28th, 2014

A team of researchers at the University of Illinois set out to study charged graphene and to uncover a method to control DNA movement through a sequencing device. During their experiments, physics professor Aleksei Aksimentiev…read more

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Fans are Low Cost and High Performance

October 28th, 2014

Qualtek Electronics has been recognized for their low cost and high performance IP54 Rated HPLC Fans. These fans are, according to the company, the highest quality in the industry today and can function in the…read more

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New Thermal Management Material Produced

October 27th, 2014

Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more

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