Applications

Heatsink 101: Everything You Ever Wanted to Know Web Seminar

March 26th, 2015

Wednesday, April 1, 2015 2:00 PM – 3:00 PM US/Eastern Online Event This web seminar focuses on how heatsinks work and how to design a heatsink while considering all the critical factors such as size,…read more

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Liquid Cooling in Mobile Devices Increases Heat Dissipation Speeds

March 24th, 2015

Fujitsu Engineers have reportedly discovered a better way to dissipate heat from mobile devices. By using liquid cooling, heat dissipation occurs five times faster than current dissipation methods. “It’s built a microscale heat pipe, less…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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Clear Encapsulant Ideal for Outdoor LED Lighting Applications

March 23rd, 2015

Dow Corning introduces a new clear and reliable Encapsulant for harsh outdoor LED lighting applications. The EI-1184 Silicone Encapsulant features high transparency, high weatherability, long lasting protection in harsh outdoor and indoor environments, and protection…read more

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New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

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New Accelerometer Eliminates Noise

March 23rd, 2015

PCB Piezotronics, Inc., announces a new crystal technology for use in high temperature applications – the Ultra High Temperature 1200 degrees Fahrenheit, or UHT-12™. “This new development solves the gas turbine manufacturers problem with ceramic based…read more

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Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics

March 20th, 2015

Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s…read more

Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

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Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

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Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

March 20th, 2015

Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to…read more

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Company Introduces Liquid Cooling Specified Couplings at SEMI-THERM

March 17th, 2015

Colder Products Company (CPC), a provider of couplings and fittings, announces the expansion of its LQ product family. The RPLQ4 series of couplings is designed for liquid cooling applications and offer security, reliability, and are…read more

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Thermal Test Chips on Display at SEMI-THERM

March 13th, 2015

Thermal Engineering Associates (TEA) will display Thermal Test Chips and Wafers at SEMI-THERM at booth 300. The wafers on display range from 200mm and 300mm and thicker ones range from 700mm to 800mm. Thinner wafers will…read more

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Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

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