Japanese electronics maker Nippon Electronics Corporation (NEC) may have taken a step towards raising the current limit on smartphone processing capabilities with the company’s unveiling of the world’s first liquid-cooled smartphone earlier this month. While…read more
5kW Solar Panels Produced More Power than Electric Car, but Not More than Dome House. How Much House Energy Consumption Did they Produce?
May 28th, 2013
Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Roger Stout. To view the webinar, click here. Question: You said your 5 kW solar panels have produced more power than you’ve used…read more
Was Your Dome House More Expensive to Build than Conventional Construction?
May 28th, 2013
Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Roger Stout. To view the webinar, click here. Question: Was your dome house more expensive to build than conventional construction? Answer:…read more
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
May 24th, 2013
Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The…read more
Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
May 23rd, 2013
Parker Hannifin Corporation, a developer of motion and control technologies, has released new two-phase evaporative liquid cooling systems for renewable energy power conversion systems. “The Parker system’s inherent cooling efficiency benefits can result total system cost…read more
New Finned Ceramic Heat Sinks Released
May 23rd, 2013
AMEC Thermasol has introduced a new range of slim finned ceramic heat sinks to complement the company’s existing range of flat- and wave-type ceramic heat sinks. According to the company, the addition of fins to…read more
Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
May 17th, 2013
An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure…read more
Quiet CPU Coolers for Intel Xeon Workstations and Servers
May 17th, 2013
Cooling component manufacturer Noctua has released a new revision of its NH-U12DX and NH-U9DX quiet CPU coolers for Intel Xeon workstations and servers. “Builders of quiet workstations and servers still have trouble finding quality cooling…read more
Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
May 17th, 2013
Oven Industries, a supplier of custom temperature controllers and sensors for a variety of industries, has released the new 5R7-001 PID bi-directional temperature controller for independent thermoelectric modules or for use in conjunction with auxiliary…read more
Fans for Low-Noise, Low-Airflow Applications
May 17th, 2013
JMC Products, a manufacturer of DC cooling fans and thermal solutions, has released three fans for low-noise, low-airflow applications. Featuring a compact design for limited-space installations, “the 30×10, 35×10, and 40×10 PWM excel in low-profile…read more
Programmable Digital Temperature Control for Electronic Enclosures
May 17th, 2013
EIC Solutions Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released a digital temperature control (DTC) for fine-tuned temperature control inside air-conditioned electronic enclosures. “[While] our standard bimetallic thermostat meets…read more
U.S. Patent for Two-Stage Enclosure Coolers Awarded
May 17th, 2013
The United States Patent and Trademark Office has awarded U.S. patent No. 8,402,773 to ITW Vortec for its two-stage cooling system Vortex A/C Enclosure Coolers. According to the company, the newly patented Vortex A/C enclosure…read more
Thermal Spreading and More Using Open-Source FEA Software
May 16th, 2013
The purpose of the present article is to suggest that accurate solution of thermal spreading problems for multilayer, edge-truncated geometry is easily accomplished using free, open-source finite element software. This should be especially attractive…read more
Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
May 16th, 2013
A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there…read more
Recent Posts
- World’s First Liquid-Cooled Smartphone Released
- World Congress on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics
- 5kW Solar Panels Produced More Power than Electric Car, but Not More than Dome House. How Much House Energy Consumption Did they Produce?
- Was Your Dome House More Expensive to Build than Conventional Construction?
- New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
- Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
- New Finned Ceramic Heat Sinks Released
- New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
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