Applications

Controlling Device for Rotational Speed of Fans with PWM Control

September 27th, 2016

Sanyo Denki has released the “San Ace PWM Controller”, a device for controlling the rotational speed of fans that have PWM control function. The controller’s main features include: reduced system power consumption and fan noise,…read more

Posted in Blowers / Fans / Filters, New Products, Power | Comments Off on Controlling Device for Rotational Speed of Fans with PWM Control

Calculation Corner: Spreadsheet-based Matrix Analysis – Extension to Transient Analysis

September 26th, 2016

by Ross Wilcoxon, Ph.D., Associate Technical Editor Over the years, a number of articles [1-3] published in ElectronicsCooling have described the use of thermal resistance networks to analyze electronic systems.  The analysis of a thermal resistance…read more

Posted in Articles, Power, Research, Software/Modeling | Comments Off on Calculation Corner: Spreadsheet-based Matrix Analysis – Extension to Transient Analysis

Surface Temperatures of Electronics Products: Appliances vs. Wearables

September 20th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at…read more

Posted in Consumer, Design, Design, Electronics Cooling Blog, Enclosures, Materials, Compounds, Adhesives, Substrates | Comments Off on Surface Temperatures of Electronics Products: Appliances vs. Wearables

Comparison of Heatsinks used for the Thermal Management of LEDs

September 13th, 2016

By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional…read more

Posted in Articles, Design, Heat Sinks | Comments Off on Comparison of Heatsinks used for the Thermal Management of LEDs

High-Performance Circuit Materials Exhibited at Upcoming Conference

September 6th, 2016

Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally…read more

Posted in Automotive, Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Power | Comments Off on High-Performance Circuit Materials Exhibited at Upcoming Conference

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

New Epoxy Ideal for High Vacuum Environments

August 30th, 2016

Master Bond has released their new two part epoxy, EP30AN-1. EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional…read more

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Thermal Conductivity & CTE of Materials: Can We Engineer Them?

August 30th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also…read more

Posted in Electronics Cooling Blog, Industrial, Materials, Compounds, Adhesives, Substrates | Comments Off on Thermal Conductivity & CTE of Materials: Can We Engineer Them?

Wide Array of Flow Switches Available

August 29th, 2016

Sika offers a wide array of flow instruments, including flow switches. Flow switch options include the VK300 Flow Switch, Trimmable Paddle for Insertion, the VK300 Flow Switch for Copper Pipes, a Flow Switch for Pool…read more

Understand Organic PCM Differences

August 29th, 2016

Microtek has a large selection of organic PCMs, offered in 3 main forms: PCM, Microencapsulated PCM, and Macroencapsulated PCM. PCM applications include shipping and packaging, solar energy systems, radiant heat flooring, industrial/commercial apparel (work vests,…read more

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Design Considerations When Using Heat Pipes

August 25th, 2016

By George Meyer, Celsia Inc. Introduction This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power…read more

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Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

August 22nd, 2016

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity,…read more

Posted in Articles, Communications, Computer, Consumer, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, Technical Brief | Comments Off on Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

Webinar and Report Available On-Demand Now

August 18th, 2016

The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends…read more

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Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

Posted in Aerospace, Automotive, Industrial, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Temporary Bonding Adhesive for Thin Wafer Handling Introduced