Applications

New Speed Controllers for Fans to Reduce Energy Consumption

May 23rd, 2016

Orion Fans has recently developed a low-cost dual channel phase control unit to control fan speed for single or multiple fan assemblies, series OA11/22. It is field adjustable, with the ability to precisely control fan noise,…read more

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Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

May 23rd, 2016

Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up…read more

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Thermal Simulation Tool for Design Engineers Available

May 23rd, 2016

In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes…read more

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Push for Better Industrial Enclosures Cooling

May 23rd, 2016

(May 18, 2016) As the heat produced by electronic components continues to increase, suggestions are made to push for improvement on better managing industrial enclosure temperatures. “Relative to each individual component, the heat of electronic…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

Posted in Communications, Computer, Coolers, Data Centers, Defense, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Researchers May Have Solved the Problem of Thermal Resistance for ICs

New Type of Graphene Could Increase Processor Clock Speeds

May 23rd, 2016

(May 19, 2016) Recently, scientists from the Moscow Institute of Physics and Technology (MIPT), the Institute of Physics and Technology RAS, and Tohoku University (Japan), have developed a new type of graphene-based transistor, whose modeling…read more

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Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

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New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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Self-Healable Electronic Material That Can Help Prevent Overheating

May 17th, 2016

(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more

Posted in Communications, Consumer, Design, Materials, Compounds, Adhesives, Substrates, News, Research, Semiconductor, TIMs | Comments Off on Self-Healable Electronic Material That Can Help Prevent Overheating

Recall On Overheating Laptop Battery Packs

May 17th, 2016

(March 31, 2016) Toshiba recently issued a voluntary recall on its laptop battery packs for potential burn and fire hazards from overheating. According to ConsumerReports.org, the battery packs were manufactured by Panasonic and installed in…read more

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Laptops May Start Producing Far Less Heat

May 17th, 2016

(May 10, 2016) Massachusetts Institute of Technology’s postdoc Cui-Zu Chang and his colleagues have been “working to create devices with components which have little [to no] resistance to the flow of electricity” in laptops, according…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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Tesla Powerwall Comes with Unexpected, Loud Electronic Hum

May 9th, 2016

With the recent residential installations of Tesla’s Powerwall home battery systems, customers have been reporting an unwanted loud electronic humming sound . Breitbart.com reported, “a German customer measured a noise level from a Powerwall installed…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

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