Coolers

New Thermoelectric Coolers Ideal for Cooling in Harsh Environments

July 1st, 2015

EIC Solutions, Inc., introduces the ThermoTEC™ series, which includes two new High Delta T Thermoelectric Air Conditioners known as the 142 series and the 146 series. The ThermoTec 142 and 146 coolers can withstand harsh…read more

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German Associations to Research Efficient Car Battery Charging

June 30th, 2015

A group of companies and universities in Germany will research how car batteries can be charged more efficiently for a project called Luftstrom.  The project focuses on using new semiconductors and water cooling to increase…read more

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Outdoor Cooler Improves Cellular Coverage; Protects Telecom Battery Cabinets

June 29th, 2015

Laird introduces its new AA-480 Series Outdoor Cooler, an air-to-air cooler that improves reliability of cell phone coverage, during power outages via emergency batteries in wireless stations. It also protects telecommunication battery cabinets and outdoor…read more

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University Installs Liquid-cooling Solution

June 23rd, 2015

CoolIT Systems has successfully installed its liquid cooling DCLC rack at the Center for Biological Sequence Analysis at the Technical University of Denmark (DTU). The DCLC rack uses waste heat and converts it into usable…read more

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Splash Proof Fan Offers Long Lifespan

June 22nd, 2015

Sanyo Denki introduces its new IP68 splash proof fan with high airflow and a long lifespan. The water and dust resistant fan’s measurements are 40 x 40 x 28 mm. It is ideal for use…read more

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Reducing Reliance on Water for Cooling in Data Centers

June 9th, 2015

The severe drought in California has spiked concerns about the availability of water to operate data centers. Since water is extremely important for cooling facilities, other approaches of water usage in data centers reportedly need…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Largest Data Center in Asia to be Completed in July 2015

June 2nd, 2015

LG U+, a telecommunications company in Gyeonggi, South Korea, announced its mega data center will be completed in Pyeongchon in July 2015. When completed, it will be the largest data center in Asia and the…read more

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New Motorized Impeller Offers High Airflow in a Rugged Design

June 1st, 2015

Orion Fans, a division of Knight Electronics, Inc., introduces a new high capacity, motorized impeller/blower, the centrifugal OAB400 Series Blower. The blower delivers airflow of up to 1900 CFM, and offers a maximum static pressure…read more

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New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

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Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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