Cooling solutions provider Noctua has released two new models from the NH-U series of quiet, single tower CPU coolers. Both models reportedly feature a “new, slim design that ensures easy RAM access and maximum compatibility…read more
New Single Tower CPU Cooler Models Feature Slim Design for Easy RAM Access and Compatibility with Tall Memory Modules
April 8th, 2013
Vibration-Free Cooling Technology to Replace Mechanical Compressors in Sensitive Space Applications
April 5th, 2013
Researchers at the University of Twente in the Netherlands have developed a new technology for cooling optical detectors on spacecraft that could help the sensors better detect weak “space signals” that originate from far-away, extremely…read more
Environmentally-Friendly Cooling System Achieves Industry’s Highest Efficiency in Compressor Mode
March 25th, 2013
A new high efficiency DX precision cooling system released by Emerson Network Power has been installed in data center service company BLACKIRON Data’s new Tier III, LEED-certified data center near Toronto, Canada. According to Ron…read more
New High Bay LED Cooler Is Smaller and Lighter Than Passive Cooling Equivalents
February 18th, 2013
Nuventix, Inc. has introduced the LED Cooler R150-170, a new high bay LED cooler that, according to the company, is “33 percent smaller and 60 percent lighter than passive cooling equivalents used in industrial high…read more
Large Enclosure Cooler Capable of Removing Heat at 5,000 BTU/Hour Receives UL Certification
February 11th, 2013
Cooling systems developer Vortec has announced the company’s newest enclosure cooler has received official UL certification this month. According to the company, the new enclosure cooler utilizes a “unique two-stage cooling process” to effectively cool…read more
New CPU Coolers Win 2013 CES Innovation Awards
January 21st, 2013
Computer cooling product developer Zalman has introduced the new CNPS FX100 Cube fanless CPU cooler and CI Water Cooler. Both coolers received Innovations Design and Engineering awards at the 2013 Consumer Electronics Show in Las…read more
Cryogenic Cooler Experiment May Lead to More Affordable and Reliable Version for Cooling Electronics
January 18th, 2013
Scientists from the University of Twente in Enschede, The Netherlands have constructed a micro-sized Joule-Thomson (JT) cryogenic cooler, in an effort to help develop a more affordable and reliable version for cooling electronics. According to…read more
Liquid to Air Heat Exchanger Systems for Demanding Thermal Management Applications
October 22nd, 2012
Laird Technologies, a manufacturer of performance-critical components and systems for advanced electronics and wireless products, has recently released the WL Series Liquid to Heat Exchanger Systems product line for use in demanding thermal management applications…read more
CPU Cooler for Compact Environment
October 3rd, 2012
Thermal solutions developer Phanteks has released the PH-TC90LS, an ultra-low profile thermal radiator for CPU cooling in a compact environment. The PH-TC90LS heat sink measures 27mm tall—34mm when the bundled fan is attached—and is compatible…read more
Company Awarded Patents for Thermal Management in Semiconductor Applications
October 3rd, 2012
Sp3 Diamond Technologies, Inc., a developer of CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management, has been awarded two patents by the United States Patent and Trademark Office for its…read more
Water Consumption in Liquid-Cooled Data Centers Remains a Concern
September 20th, 2012
Though water is not used by all data centers, it is a critical component for some data center cooling systems and overuse of it can potentially affect area water supplies. Large data centers using evaporative…read more
New Software Added to Computer-Aided Engineering Software Suite
September 18th, 2012
Altair, the developer of the HyperWorks computer-aided engineering software suite, has announced the addition of TES International’s software ElectroFlo to the group of applications available through the HyperWorks Partner Alliance (HWPA). ElectroFlo is an electronics…read more
Single Electron Diode May Control Heat Flow in Tiny Future Electronics
September 11th, 2012
As the scale of electronic devices and their components continues to shrink, researchers at Aalto University in Finland are re-examining options for fine-tuning control of the heat generated by electronic components. Doctoral student Tomi Ruokola,…read more
Cloud Computing May Solve Data Center Cooling Cost Issues
September 10th, 2012
InformationWeek Reports, a service provider for peer-based IT research and analysis, recently released its “2012 State of the Data Center” report, which contains the results of its annual State of the Data Center Survey and…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
