Coolers

Visitors Encouraged to Visit New Website Launch

June 21st, 2016

(June 20, 2016) IMS has recently launched a newly redesigned website with improved functionality. The company’s mission to provide the electronics manufacturing industries with the highest quality devices and components is clearer, according to IMS,…read more

Posted in Applications, Coolers, Defense, LED / Lighting, Medical, News, Power | Comments Off on Visitors Encouraged to Visit New Website Launch

Two New Approaches to Thermal Management Problems

June 21st, 2016

(June 14, 2016) Recent research is looking at two opposite physical effects to keep chips cool by possibly distributing process loads across multiple cores. According to NewElectronics.co.uk, the National Physical Laboratory (NPL) is conducting two…read more

Posted in Computer, Coolers, News | Comments Off on Two New Approaches to Thermal Management Problems

A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

Posted in Coolers, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Semiconductor | Comments Off on A Cooler Microchip Design with a Black Semiconductor

Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

Posted in Computer, Coolers, Design, Liquid Cooling, News | Comments Off on Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

Sizes Added to Backward-Curved Impeller Line

June 8th, 2016

Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to…read more

Posted in Computer, Coolers, Liquid Cooling, New Products, Power | Comments Off on Sizes Added to Backward-Curved Impeller Line

How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Laser Storage in Data Centers Could Mean Less Heating

June 7th, 2016

(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling.…read more

Posted in Coolers, Data Centers, Design, News | Comments Off on Laser Storage in Data Centers Could Mean Less Heating

Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

May 23rd, 2016

Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up…read more

Posted in Coolers, Design, Industrial, New Products, Semiconductor, TECs | Comments Off on Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

Push for Better Industrial Enclosures Cooling

May 23rd, 2016

(May 18, 2016) As the heat produced by electronic components continues to increase, suggestions are made to push for improvement on better managing industrial enclosure temperatures. “Relative to each individual component, the heat of electronic…read more

Posted in Coolers, Design, Enclosures, News | Comments Off on Push for Better Industrial Enclosures Cooling

Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

Posted in Communications, Computer, Coolers, Data Centers, Defense, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Researchers May Have Solved the Problem of Thermal Resistance for ICs

New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

Posted in Blowers / Fans / Filters, Computer, Coolers, Data Centers, Heat Sinks, New Products | Comments Off on New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Coolers, Design, Design, News, Plastics, Power, Software/Modeling | Comments Off on Software Update Leads to Device Failure by Overheating

Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

Posted in Aerospace, Automotive, Computer, Coolers, Defense, Materials, Compounds, Adhesives, Substrates, Medical, News, Semiconductor | Comments Off on Potential Electronics Cooling Application of Carbon Nanotubes

Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

Posted in Computer, Coolers, Design, Design, Heat Exchanger, Heat Pipes, News, Research | Comments Off on Metal Inverse Opals Could Better Cool Electronics