Coolers

Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

Posted in Aerospace, Automotive, Computer, Coolers, Defense, Materials, Compounds, Adhesives, Substrates, Medical, News, Semiconductor | Comments Off on Potential Electronics Cooling Application of Carbon Nanotubes

Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers

Electrocaloric Polymers That Create On-Demand Cooling

April 11th, 2016

A team of researchers from Pennsylvania State University have recently developed a blend of ferroelectric polymers that could cool chips and small scale systems on demand. According to NewElectronics these are called electrocaloric materials, and…read more

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Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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Smart Clothing That Automatically Cools Itself

April 4th, 2016

VTT Technical Research Centre of Finland Ltd has recently developed a technology that can be utilized in smart fabrics and clothing to cool or warm the wearer according to his or her needs as part…read more

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New Coolers for Laser Diodes Released

March 29th, 2016

Recently Rogers Corporation’s Power Electronics Solutions (PES) group has released its new curamik CoolPerformance Plus coolers. Roger’s said that “curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and…read more

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New Energy Efficient Air-to-Air Outdoor Cooler Released

March 29th, 2016

Laird has released its new air-to-air outdoor cooler, the AA-480 Series, that is smaller and more energy efficient than similar units on the market. The cooler has “480 Watts of cooling power and a Coefficient…read more

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New Particle Creates Less Heat, Saves Energy

March 28th, 2016

Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and…read more

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New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

March 21st, 2016

Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect…read more

Posted in Blowers / Fans / Filters, Coolers, Data Centers, Heat Exchanger, IT Products, New Products, Refrigeration | Comments Off on New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

Overcoming Cooling Challenges Downloadable Webinar Now Available

March 21st, 2016

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

NSA Finally Has a Plan for Their Superconducting Supercomputer

March 7th, 2016

The U.S. government has its eyes on “cryogenically cooled circuitry for tomorrow’s exascale computers,” reported Spectrum.IEEE.org, a dream over 50 years old. An electrical engineer of the NSA, Dudley Buck, “reported on his own work”…read more

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