Coolers

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

IC Coolers for Limited-Space Requirements

August 11th, 2016

Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot…read more

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Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

July 12th, 2016

Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According…read more

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Portable Air Conditioning Are Temporary Saviors for Data Centers

June 28th, 2016

(June 27, 2016) In case of a loss of power, mechanical failure, or planned maintenance, portable air conditioning might be an efficient solution to cool data centers’ electronics. According to ACHRNews.com, contractors and data center…read more

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Special Design of All-Electric Supercar is Efficient Cooling Step Forward

June 28th, 2016

(June 27, 2016) In a recent interview with Faraday Future’s head of global design, Richard Kim explained their new FFZERO1 Concept car’s efficient cooling platform. “With the FFZERO1 we looked to push the limit in…read more

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Visitors Encouraged to Visit New Website Launch

June 21st, 2016

(June 20, 2016) IMS has recently launched a newly redesigned website with improved functionality. The company’s mission to provide the electronics manufacturing industries with the highest quality devices and components is clearer, according to IMS,…read more

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Two New Approaches to Thermal Management Problems

June 21st, 2016

(June 14, 2016) Recent research is looking at two opposite physical effects to keep chips cool by possibly distributing process loads across multiple cores. According to NewElectronics.co.uk, the National Physical Laboratory (NPL) is conducting two…read more

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A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

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Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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Sizes Added to Backward-Curved Impeller Line

June 8th, 2016

Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Laser Storage in Data Centers Could Mean Less Heating

June 7th, 2016

(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling.…read more

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Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers

May 23rd, 2016

Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up…read more

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Push for Better Industrial Enclosures Cooling

May 23rd, 2016

(May 18, 2016) As the heat produced by electronic components continues to increase, suggestions are made to push for improvement on better managing industrial enclosure temperatures. “Relative to each individual component, the heat of electronic…read more

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