Advanced Thermal Solutions, Inc.’s new series of its maxiFLOW™ heat sinks now include an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components Each heat…read more
New Air-Cooling Technology Reduces Energy Use
July 11th, 2011
Sandia National Laboratories has developed a proprietary air-cooling invention, the “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger.” The Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool…read more
Honeycomb Heat Sink Utilizes Science of Real Honey Bees
June 13th, 2011
Utilizing the science of real honey bees, JaroThermal’s newest Honeycomb heat sink directs heat towards the outside, while producing a steady flow of cool air on the inside. A multi-holed design and increased surface area…read more
Forced Convection Heat Sink Thinner than a Credit Card
May 23rd, 2011
Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more
Connector/Decoupler Integrated in a Heat Sink
April 11th, 2011
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more
Niagara Thermal Products Acquires Thermshield
March 23rd, 2011
Niagara Thermal Products LLC’s acquisition of Thermshield, LLC brings together two companies in the design and supply of custom thermal solutions across a wide range of markets and applications. Niagara Thermal and Thermshield will continue…read more
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 2
March 2nd, 2011
These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA…read more
Sensor Film Monitors Surface Temperature Variations in Heat Sinks
February 21st, 2011
Thermex® is a thin sensor film that can be used in multiple applications to test and monitor heated contacting surfaces from 200° to 300°F (93° to 149°C). Upon exposure to heat, Thermex® changes color instantaneously…read more
Thermal Company Partners With Packaging Services Firm
February 4th, 2011
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS…read more
DoD Extends Contract for Heat Sink Technology
February 4th, 2011
Thermacore was awarded a $3 million Option Phase contract extension by the Defense Advanced Research Projects Agency (DARPA) to continue the development and commercialization of active heat sink technologies for Micro-technologies for Air-Cooled Exchangers (MACE).…read more
Laser Cooling Systems Offer Heatsink Module
January 25th, 2011
Elite Thermal Engineering (ETE) introduces turnkey cooling systems for fiber coupled laser diodes produced by LIMO, Jenoptik, QPC and nLight. The cooling systems can also be customized for fiber coupled laser diodes manufactured by other…read more
Researcher Wins Award for Electronics Cooling Technologies
January 25th, 2011
The National Science Foundation has awarded the 2011 Alexander Schwarzkopf Prize for Technological Innovation to a Purdue University professor for his research to develop advanced cooling technologies for electronics and cars. The prize specifically recognizes…read more
Report: Thermal Management Technologies to Reach $8.6 Billion by 2015
January 10th, 2011
The global market for Electronic Thermal Management is forecast to reach $8.6 billion by 2015, according to market research company Electronics.ca Publications. Factors driving growth include developments in technology and marked increase in the production…read more
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
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