Liquid Cooling

New Liquid Cooled HPC Cluster Launched

February 8th, 2016

CoolIT Systems has successfully completed the second deployment of its Rack DCLC™ liquid cooling solution at the Poznan Supercomputing and Networking Center (PSNC) in partnership with Huawei. The liquid cooled solution is part of the HPC…read more

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Underwater Data Center Test Proves Successful

February 1st, 2016

Microsoft, who manages more than 100 data centers around the world, has completed testing of a self-contained data center prototype that can operate hundreds of feet below the surface of the ocean. The New York…read more

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Protection Coatings for Coolers to be Presented at Upcoming Conference

January 18th, 2016

On February 26 at the Photonics West Conference in San Francisco Rogers Corporation’s Power Electronics Solutions (PES) will be presenting a report on ACT’s vapor-deposited Applied Nanoscale Corrosion Resistant (ANCER™) coatings in partnership with Advanced Cooling…read more

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Innovative Liquid Cooling Technology for the ExaNeSt Project

January 8th, 2016

Iceotope is using innovative liquid cooling technology for the European project ExaNeSt as reported by Inside HPC. The ExaNeSt project objective is to develop a prototype exascale supercomputer in three years. Peter Hopton from Iceotope…read more

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A Liquid Cooling Method for FPGAs

January 6th, 2016

Georgia Institute of Technology researchers are using microfluidic channels to cool 28nm Altera FPGAs. The university said that by “flowing de-ionized water through” the “microfluidic passages cut directly into the backsides of production FPGAs […]…read more

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The World’s First Liquid-Cooled Gaming Laptop

December 11th, 2015

The Asus ROG GX700 has been introduced as the world’s first liquid-cooled gaming laptop. Asus ROG Global Marketing Director Derek Yu created the inch-thick laptop with a Nvidia GTX 980M graphics card, and with the…read more

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Heat-pipes May be a Solution for Heat Dissipation in New Smartphone

December 8th, 2015

According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone’s processor. “Tiny pipes inside the phone are filled with a liquid coolant, which circulates around…read more

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Liquid Cooling – ‘Practical Guidelines to Design & Manufacture’ Webinar

December 3rd, 2015

Industry trends continue to produce smaller footprints with higher power densities. In some cases, Liquid Cooling is the answer for cooling your application. This discussion will go over the basic design and structure of several…read more

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Researchers Use Infrared Laser to Refrigerate Liquids

November 23rd, 2015

Recently, the University of Washington research team has successfully used an infrared laser to cool water. According to Phys.org, the process uses a microscopic crystal suspended in water and an infrared laser light, to cool…read more

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Compact PC with Liquid Cooling System

November 16th, 2015

Simon Laine, a Swedish PC modder, recently built a PC with a liquid cooling system. According to Forbes, the PC known as “Luna” has an Intel Core i7-4770R, which has Iris Pro 5200 graphics. For…read more

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Microfluidic Channels Deliver Power and Cooling in Computational Hardware

November 16th, 2015

IBM’s fluid research labs are currently testing “5D electronic blood” to deliver power and cooling in computational hardware. “Using IBM’s developed microfluidic channels on a sample chip, it is able to funnel in a cooling…read more

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Second Deployment of Liquid Cooling Solution Scheduled for Supercomputing Center

November 16th, 2015

Recently, CoolIT Systems announced it is delivering a second deployment of its Rack DCLC™ data center liquid cooling solution to the Poznan Supercomputing & Networking Center. “The PSNC cluster expansion combines Huawei blade servers in…read more

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Immersion Cooling in Bitcoin Mining Data Centers

November 9th, 2015

Power densities in bitcoin mining data centers are radically higher than in data centers that house traditional IT equipment. Some data centers have found that by bringing bitcoin mining ASICs, or Application Specific Integrated Circuits,…read more

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Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

November 2nd, 2015

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry. “To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and…read more

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