Liquid Cooling

New DoE Efficiency Standard for Pumps

August 8th, 2016

(August 8, 2016) The minimum efficiency standards for general-purpose, three-phase motors have been raised. “The U.S. Department of Energy (DoE) recently released new efficiency standards for commercial and industrial pumps that are based on efficiency…read more

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Liquid Cooled Computer Runs Train Safety Big Data Analysis

July 26th, 2016

(July 15, 2016) According to CBROnline.com, the “Institute of Railway Research has chosen a liquid cooled high-performance computer to run railway safety big data risk analysis.” “The HPC called PetaGen 1C, immerses Intel server electronics…read more

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Tech Brief: Visualization of Flow Boiling of R245fa in a Microgap with Integrated Staggered Pin Fins

July 7th, 2016

Pouya Asrar *, Xuchen Zhang, Craig E. Green, Peter A. Kottke, Thomas E. Sarvey, Andrei Fedorov, Muhannad S. Bakir, and Yogendra K. Joshi* Introduction Two phase cooling has become a promising technique for managing high…read more

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Liquid Cooled Data Center with More Power and No Leakage

July 5th, 2016

(June 29, 2016) Recently, eBay, Dell, and Intel claimed to have made “major strides in channeling the potential of liquid cooling” to enable greater processing power without excessive consumption “that could have implications for the…read more

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Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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Sizes Added to Backward-Curved Impeller Line

June 8th, 2016

Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Custom Liquid Cooling System for Data Centers

June 7th, 2016

(June 2, 2016) “A special unit within Dell that makes custom tech for operators of the world’s largest data centers, has designed a water-based system for cooling custom server chips it developed” for eBay with…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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Innovative Water Boiling Approach Could Cool Advanced Electronics

May 9th, 2016

Oregon State University engineers have recently discovered a new way to make advanced electronics more efficient by inducing and controlling boiling bubble formations. According to ScienceDaily.com, “The new approach is based on the use of…read more

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Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

May 3rd, 2016

(April 7, 2016) Watly has recently launched an Indiegogo campaign to raise the final needed funds for the release of its water sanitizing and electricity generating computer powered entirely by solar energy. The Watly 3.0…read more

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Enhanced Two-Phase Impingement Technologies for Electronics Cooling

April 14th, 2016

  Enhanced Two-Phase Impingement Technologies for Electronics Cooling Matthew J. Rau*, Ercan M. Dede†, Shailesh N. Joshi† *School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, IN 47907 USA †Electronics Research Department, Toyota…read more

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iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

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Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

April 14th, 2016

Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era…read more

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