The hidden hardware helping AI’s heat problem If it feels like the semiconductor market is suddenly back in the headlines, that’s because it is. ASML, the world’s leading supplier of photolithography systems, recently reported that its shares have risen around 97 per cent over the past six months, reflecting renewed investment in chip production. Yet behind the headlines, … [Read more...]
Dow Introduces the Dow Coolant Care Network to Simplify Data Center Liquid Cooling Management
MIDLAND, Mich. — May 18, 2026 — Dow (NYSE: DOW) today announced the launch of Dow Coolant Care Network, an end-to-end service model designed to help data center operators protect uptime, reduce operational risk, and confidently manage direct-to-chip liquid cooled systems using DOWFROST™ LC and DOWFROST™ HD Heat Transfer Fluids. As hyperscale and high-performance data centers … [Read more...]
Gates Introduces 3″ and 4″ Data Master™ MegaFlex™ Hoses to Unlock Higher-Capacity Cooling for Data Centers
New large-diameter hoses open access to more applications—supporting higher flow rates and improving installation efficiency across cooling loops. DENVER, May 11, 2026 -- Gates Corporation (NYSE: GTES), a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, is expanding its Data Master MegaFlex hose portfolio with new 3-inch and … [Read more...]
Save Your Seat for Thermal Live Spring 2026, May 19
Registration is open for Thermal Live Spring 2026 Join Electronics Cooling on May 19 for a day of technical sessions and product demos focused on real-world thermal challenges. Register Now Thermal Live Spring 2026 brings together hundreds of engineers and technology leaders to share practical insight into the latest advances in cooling, materials, and system … [Read more...]
High-Performance Copper Tungsten Cold Plates for Direct-to-Chip Single-Phase Liquid Cooling
In April 2025, Google announced its 1 MW 42U rack [1], marking a turning point in data center thermal management where traditional air cooling can no longer support the extreme power densities of modern hardware. As chip thermal design power (TDP) continues to grow, data centers must replace air-cooled heat sinks with liquid-cooled cold plates [2]. Cold plates transfer heat … [Read more...]
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