Liquid Cooling

Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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Innovative Water Boiling Approach Could Cool Advanced Electronics

May 9th, 2016

Oregon State University engineers have recently discovered a new way to make advanced electronics more efficient by inducing and controlling boiling bubble formations. According to ScienceDaily.com, “The new approach is based on the use of…read more

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Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

May 3rd, 2016

(April 7, 2016) Watly has recently launched an Indiegogo campaign to raise the final needed funds for the release of its water sanitizing and electricity generating computer powered entirely by solar energy. The Watly 3.0…read more

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Enhanced Two-Phase Impingement Technologies for Electronics Cooling

April 14th, 2016

  Enhanced Two-Phase Impingement Technologies for Electronics Cooling Matthew J. Rau*, Ercan M. Dede†, Shailesh N. Joshi† *School of Mechanical Engineering, Purdue University, 585 Purdue Mall, West Lafayette, IN 47907 USA †Electronics Research Department, Toyota…read more

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iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

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Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

April 14th, 2016

Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era…read more

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New Coolers for Laser Diodes Released

March 29th, 2016

Recently Rogers Corporation’s Power Electronics Solutions (PES) group has released its new curamik CoolPerformance Plus coolers. Roger’s said that “curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and…read more

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Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade

March 29th, 2016

Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now…read more

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Study Shows LED Lighting Helps Grow Edible Plants for Space Missions

March 28th, 2016

The University of Arizona Controlled Environment Agriculture Center (CEAC) and Phillips Lighting have conducted a recent study to find that placing LED lighting in a lunar greenhouse prototype increases the amount of high-quality, edible lettuce…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Cooling High-Powered Electronics with Tiny Drops of Water

March 21st, 2016

Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a…read more

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Pause On Boiling May Lead to Next-Gen Tech for Thermal Management

March 1st, 2016

A Professor at Syracuse University, Shalabh Maroo, his research group, and collaborators at NIST and RPI have “created a single vapor bubble in a pool of liquid that can remain stable on a surface for…read more

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New Smartphone to Use Heat Pipe Cooling

March 1st, 2016

Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology…read more

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New PWM Temperature Controller for Liquid Chiller

February 19th, 2016

TECA Corporation’s TLC-900 Bench Top Liquid Chiller has recently been upgraded with a Pulse Width Modulating (PWM) controller incorporating four PID temperature ranges. This upgrade will improve temperature control over a wide temperature range while…read more

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