Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
December 5th, 2013
New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
November 22nd, 2013
The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED,…read more
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
November 21st, 2013
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld…read more
Patent for Thermal Interface Material with Thin Transfer Film or Metallization
November 11th, 2013
The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA. According to background information provided by…read more
Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers
November 7th, 2013
Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company,…read more
New Low-Thermal Resistance Gap Filler Pad
October 21st, 2013
Fujipoly has released new Sarcon GR25A-0H2-30GY, a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. According to the company, the material’s new formulation dramatically reduces material tearing and damage…read more
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
September 11th, 2013
R. Shrestha, K. M. Lee and T. Y. Choi – University of North Texas D. S. Kim – POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin…read more
New Low Resistance TIM Delivers 6.0 W/m°K Thermal Conductivity
September 9th, 2013
Thermal interface material provider Fujipoly has released Sarcon GR45A-00, a very low modulus thermal interface material with a low thermal resistance. Featuring a thermal conductivity of 6.0 W/m°K per ASTM D2326 (4.5 W/m°K per ISO/CD…read more
New Multi-Tasking Robot Platform for Thermal Grease Dispensing Applications
August 26th, 2013
Automated liquid dispensing equipment provider Fisnar has announced the release of a new multi-tasking robot designed to assist with safe and secure dispensing applications ranging from miniature SMT circuit boards to larger PCBs and finished…read more
Thermally Conductive Acrylic Interface Pads
July 8th, 2013
Electronic component distributor Digi-Key has announced the availability of 3M’s 5590H series thermally-conductive acrylic interface pads for effective heat transfer and vibration dampining in demanding thermal applications. According to the company, the new 5590H series…read more
Gap Filler Thermal Interface Material for Silicone-Sensitive Electronic Applications
July 8th, 2013
The Bergquist Company, a supplier of thermal management materials, has released Gap Filler 1500LV, a new “low volatility, two-component, liquid-dispensable thermal interface material that offers the high temperature resistance and low modulus of a silicone…read more
Two Thermally Conductive Compounds Added to TIM Product Line
June 7th, 2013
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications,…read more
PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal Management
May 13th, 2013
Karthik Vijay, Indium Corporation’s technical manager for Europe, Africa and the Middle East, will present “Solder TIMs for Superior Thermal Management in Power Electronics” at PCIM Europe on Thursday, May 16 in Nuremberg, Germany. Vijay’s…read more
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
April 22nd, 2013
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM…read more
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