Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM…read more
IBM Awarded Contract in First Phase of DARPA ICECool Program
April 19th, 2013
Researchers at IBM Corp. in New York are reportedly examining potential ways to directly integrate liquid cooling into microchip designs and packaging to help “close the gap” between the chip and chip-cooling technologies in high…read more
Report Examines Trends in the Global TIM Materials Market
April 19th, 2013
BCC Research has released a new market research report, titled “Thermal Interface Materials: Technologies, Applications and Global Markets.” According to the market research company, the primary goal of the new report is to provide “an…read more
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
March 19th, 2013
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic…read more
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
March 11th, 2013
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high…read more
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
February 25th, 2013
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher…read more
Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface
December 31st, 2012
Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance…read more
Researchers Develop Possible New Heat Dissipation Method with Cold Plasma Treatment
November 9th, 2012
Researchers from the College of Materials Science and Engineering at Beijing University of Chemical Technology in China have determined a new method for enhancing heat dissipation in microelectronics based on research on plasma-treated h-BN fillers.…read more
Cell Phone Battery Bursts into Flames in Man’s Back Pocket
August 28th, 2012
A cell phone battery spontaneously caught fire last month at a Defcon software hacker’s session – while in the back pocket of the owner’s pants. The phone caught on fire, burned through the anonymous man’s…read more
Carbon Fiber Sheet Prototype Challenges Thermal Grease
August 9th, 2012
Sony Chemical & Information Device Corp. displayed a prototype of a sheet whose thermal conductivity it claims is equivalent to that of thermal grease and has a longer life span. The sheet, known as EX20000C,…read more
New Thermally Conductive Silicone Thermal Interface Material
August 6th, 2012
NuSil Technology LLC presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with…read more
New Family of Highly Thermally-Conductive Bonding Materials
May 22nd, 2012
Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications. THERCOBOND™ materials are specially designed for power electronic device packaging and…read more
Researchers Control Heat Flow with Atoms
May 7th, 2012
Through a combination of atomic-scale materials design and ultrafast measurements, researchers at the University of Illinois have revealed new insights about how heat flows across an interface between two materials. The researchers demonstrated that a…read more
Multi-Port Cages with Thermal Management
May 4th, 2012
dataMate™, a division of Methode Electronics, Inc.’s Data Solutions Group, announced the development of a patent pending SFP+ cage system with advanced thermal management features to prevent data error and hardware failure due to excessive…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
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