Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and…read more
Self-Healable Electronic Material That Can Help Prevent Overheating
May 17th, 2016
(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more
Graphene Nanoflakes Better Dissipates Electronics’ Heat
May 2nd, 2016
(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more
Thermal Innovations Win Award and Industry Recognition
April 25th, 2016
(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the…read more
iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT
April 14th, 2016
iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more
New TIMs That Offer High Thermal Conductivity
March 21st, 2016
Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more
Registration for Thermal Conference Opens
March 21st, 2016
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more
New High-Performance Thermal Interface Thin Film
March 1st, 2016
Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c. The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor…read more
Compressible, Recyclable, Metal TIM for LED Manufacturing
February 15th, 2016
The Indium Corporation will feature Heat-Spring®, their new compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, California. The Heat-Spring® interface provides 86 W/mK of thermal conductivity using…read more
Nominations Open for IEEE ITherm Achievement Award
February 8th, 2016
The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more
New High-Performance, Conforming TIM
February 1st, 2016
Fujipoly America has just introduced its newest high-performance, low compression force putty-like thermal interface material, Sarcon PG80A. The TIM’s “13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer…read more
New Soft TIM with Low Thermal Resistance
November 23rd, 2015
Fujipoly recently introduced the Sarcon® GR80A, which is a soft thermal interface material that also has a low thermal resistance. According to the company, the thermal interface material is available in sheets from 0.3mm to…read more
New Thermal Management Material for Semiconductors
October 19th, 2015
Honeywell Electronic Materials has announced the availability of a new thermal management material for semiconductors – the Honeywell PTM6000 Phase Change Material (PCM). The PTM6000 was designed to meet both high performance needs and long…read more
TIM with EMI Absorption Capabilities Announced
August 24th, 2015
Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more
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