Please find below some recent research in Thermal Interface Materials (TIMs). Low melting alloy composites as thermal interface materials with low thermal resistance Haoran Wen, Yaqiang Ji Kai Zhang, Matthew M.F. Yuen, S.W. Ricky Lee, Xian-Zhu Fu, Rong Sun & Ching-Ping Wong Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal … [Read more...]
SEMI-THERM 33 2017 Exhibits Highlights – Part 1
SEMI-THERM 33 concluded last week at Silicon Valley, CA and Electronics Cooling was the only media and content provider present on the exhibit floor. We take this opportunity to thank our readers and contributors who stopped by our booth to learn about our plans for this year including 2017 Thermal Live! We are so pleased to know that many of you like our content, our new … [Read more...]
The US Navy is Looking for a Few Good TIMs!
The first Small Business Innovation Research (SBIR) announcement for 2017 by the US Department of Defense (DoD) is out and there is one topic of great interest to thermal management professionals: topic # N171-081 “High Performance Thermal Interface Material for Energy Storage Devices and Other Electronic Components” by the US Navy, which is seeking thermal interface materials … [Read more...]
SDP-5040-A/B Gap Fillers To Advance Thermal Management Applications
In and effort to increase the options available to thermal engineers in the growing market for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) recently premiered its SDP-5040-A/B Gap Filler product. The non-adhesive product is part of the high performing SDP Series which are Two … [Read more...]
New Thermally Conductive Interface Material Announced
Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and no bleeding. It is designed to dissipate heat away from electronic components such as semiconductors and temperature sensing … [Read more...]
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