Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several…read more
Thermal Pad Offers Advantages of Thermal Grease Without Mess
March 3rd, 2014
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
February 28th, 2014
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more
Towards Reproducible ASTM D5470 Measurements at Lower Cost
February 28th, 2014
Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be…read more
Carbon Nanotubes Boost Microprocessor Cooling
February 4th, 2014
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more
PCMA Thermal Interface for Intel Core LGA-115x Processors
February 4th, 2014
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a…read more
New Ultrathin Material May Lead to Better Thermally Conductive Coatings
January 10th, 2014
Scientists at Kansas State University have discovered a new ultrathin electrically conductive material they say may lead to advances in the efficiency of electronic and thermal devices. Vikas Berry, the William H. Honstead professor of…read more
Highly-Conformable Gap Filler Pad with Reinforced Mesh Center
December 9th, 2013
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas.…read more
Carbon Nanotubes Offer Thermal Stress Relief at Critical Juntions
December 9th, 2013
Scientists at Stanford University have released new findings that demonstrate the benefits of using carbon nanotube arrays at critical junctions between two materials to help better relieve thermal stress. Thermal stress, often caused by the…read more
New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential
December 5th, 2013
Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more
New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
November 22nd, 2013
The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED,…read more
Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics
November 21st, 2013
Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld…read more
Patent for Thermal Interface Material with Thin Transfer Film or Metallization
November 11th, 2013
The U.S. Patent and Trademark Office has awarded patent No. 8,545,987, “Thermal Interface Material with Thin Transfer Film or Metallization” to Laird Technologies, Inc. of Earth City, Mo., USA. According to background information provided by…read more
Nanodiamond Filler Ups Conductivity of Thermally-Conductive Polymers
November 7th, 2013
Carbodeon, a supplier of superhard materials such as nano-diamonds and graphitic carbon nitride, has released a new thermally-conductive nanodiamond filler it claims increases the conductivity of thermally-conductive polymers by 25 percent. According to the company,…read more
Recent Posts
- TTI Analyzers Offer Low-Cost Solution for Non-Invasive Thermal Design Verification
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- SEMI-THERM Selects 2014 THERMI Award Recipient
- Expanded Product Catalog Features New Thermal Interface Materials
- Thermal Pad Offers Advantages of Thermal Grease Without Mess
- Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
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