TIMs

Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation under Thermal Duress

May 20th, 2015

By: Chandan K. Roy1, Sushil Bhavnani1, Michael C. Hamilton2, R. Wayne Johnson3, Roy W. Knight1, & Daniel K. Harris1 1 Department of Mechanical Engineering, Auburn University, Auburn, AL 2 Department of Electrical and Computer Engineering,…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Summary of ‘Thermal Interface Materials Predictions 2015-2025’

April 7th, 2015

A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.  “The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated…read more

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New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

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Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

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Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

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New TIM Improves Cooling Performance

February 19th, 2015

Fujipoly America Corporation introduces its new Sarcon 250G-HF2d thermal interface material. This TIM is made of reinforced nylon mesh and a low-tac surface treatment to prevent die-cut holes from collapsing. The Sarcon 250G-HF2d improves cooling…read more

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New Thermal Gaskets Easily Transfer Heat

December 9th, 2014

Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more

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Carbon Based Thermal Interface Material for High Performance Cooling

December 2nd, 2014

Ioan Sauciuc, Jelena Culic-Viskota, Intel Corporation  Rei Yamamoto, Michiaki Yajima, Hitachi Chemical Abstract— The focus of this paper is on the development of a novel thermal interface material (TIM) called Vertical Carbon TIM (VCTIM). This…read more

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THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

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Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

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New TIMs made of Soft Materials

November 10th, 2014

Two students at Texas A&M University, along with assistant professor of chemical engineering, Dr. Mustafa Akbulut, have announced new thermal interface materials they have produced in a project funded by DARPA. These TIMs have “a…read more

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New Thermal Management Material Produced

October 27th, 2014

Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more

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