TIMs

TIM with EMI Absorption Capabilities Announced

August 24th, 2015

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more

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New TIMs for ECUs and Embedded Systems Cooling

August 12th, 2015

Fujipoly America Corporation introduces an assortment of TIMs for commercial and military vehicle ECUs and embedded systems cooling. “The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly…read more

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Three New Lines of TIMs Offer High Thermal Conductivity

August 12th, 2015

Aavid Thermalloy introduces three new lines of high-performance thermal interface materials – thermally conductive gap fillers. The three lines include the SuperThermal™, SoftFlex™, and WaveBlocker™. These product lines offer very high thermal conductivity without compromising…read more

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New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

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Next-generation TIM Offers Double the Thermal Performance

June 1st, 2015

Dow Corning introduces a next generation thermal interface material (TIM 1) called the TC-3040 – which is a thermally conductive gel that delivers double the thermal performance of any other TIM in the industry. “TIM-1…read more

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Heat Sink Attachment Improves Heat Transfers and TIM Performance by 20 Percent

June 1st, 2015

Advanced Thermal Solutions, Inc. introduces the clipKIT – a heat sink attachment system available from Digi-Key. The clipKIT can be used with mostly any industry standard heat sink, such as straight fin, pin fin, cross…read more

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Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation under Thermal Duress

May 20th, 2015

By: Chandan K. Roy1, Sushil Bhavnani1, Michael C. Hamilton2, R. Wayne Johnson3, Roy W. Knight1, & Daniel K. Harris1 1 Department of Mechanical Engineering, Auburn University, Auburn, AL 2 Department of Electrical and Computer Engineering,…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Summary of ‘Thermal Interface Materials Predictions 2015-2025’

April 7th, 2015

A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.  “The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated…read more

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New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

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Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

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Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

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New TIM Improves Cooling Performance

February 19th, 2015

Fujipoly America Corporation introduces its new Sarcon 250G-HF2d thermal interface material. This TIM is made of reinforced nylon mesh and a low-tac surface treatment to prevent die-cut holes from collapsing. The Sarcon 250G-HF2d improves cooling…read more

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