Alexander Balandin, a professor of electrical engineering at the UC Riverside Bourns College of Engineering, and researchers from The University of Texas at Austin, The University of Texas at Dallas and Xiamen University in China,…read more
Company Launches YouTube Channel for Engineers
January 17th, 2012
Today Fujipoly America announced the launch of a YouTube channel that will provide engineers with 24/7 access to useful technical information on Thermal Interface Materials and Elastomeric Connectors. The company’s first video post includes a…read more
New Graphene Material Conducts Heat Faster than Silicon
January 17th, 2012
A new graphene material capable of conducting heat 20 times faster than silicon could make the next generation of electronic devices quieter and longer-lasting. The experimental graphene made by U.S. and Chinese researchers has also…read more
Precision High Voltage Modules
December 22nd, 2011
Spellman High Voltage Electronics Corporation’s new V6 high precision, cost-effective high voltage modules on a common platform include either AC or DC input, with analog or digital interface (RS232) capabilities. The V6 Series offers output…read more
Tiny Solar Cell Saves Money and Energy
December 22nd, 2011
The U.S. Department of Energy’s National Renewable Energy Laboratory recently validated greater than 41 percent efficiency at a concentration of 1,000 suns for tiny cells made by Semprius. The energy conversion efficiency of a solar…read more
Two-Phase Cooling Technology Powered Rack for Wind Turbine Systems
December 12th, 2011
Parker Hannifin Corporation’s new precision cooled rack for cooling critical wind turbine systems features two-phase evaporative cooling technology, which uses non-corrosive, non-conductive fluid, as it vaporizes and cools hot surfaces on contact. Parker’s Precision-Cooled Rack…read more
Companies Announce Partnership for Global Distribution
November 21st, 2011
Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty…read more
Thermal Solver with Heat Transfer Simulation Package
November 21st, 2011
MAYA HTT’s TMG-Thermal solver provides a comprehensive heat transfer simulation package, which allows fast and accurate solutions to complex thermal problems. Using finite difference control volume technology, TMG-Thermal makes it easy to numerically simulate nonlinear…read more
Miniaturization a Driving Force in Thermal Management Technologies Market
November 8th, 2011
By 2016 the thermal management technologies market will be worth nearly $11 billion, compared with a 2010 value of $7.5 billion and $8 billion in 2011. According to a new report available on companiesandmarkets.com, this…read more
Gap Filler Pad with Low-Tac Top Surface
October 11th, 2011
Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to…read more
Tapes Protect Components from Harsh Environments
October 11th, 2011
Polyonics’ new family of temperature and chemical resistant tapes remain dimensionally stable in extreme manufacturing environments including ultra-high temperatures up to 500°C. The tapes are specifically engineered using Polyonics ThermoGard™ technology to isolate sensitive, precise…read more
Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates
September 27th, 2011
Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more
Standard Test Method for Pressure Calibration of Thermal Analyzers
July 22nd, 2011
This test method, ASTM E2744-10, describes the calibration or performance confirmation of the electronic pressure signals from thermal analysis apparatus. The values stated in SI units are to be regarded as standard. No other units…read more
Non-Flowing Silicone-Based Thermal Grease
July 11th, 2011
Fujipoly’s new Sarcon® SG-26SL silicone-based thermal grease delivers a thermal conductivity of 2.6 W/m°K while exhibiting minimal bleed and evaporation characteristics. The non-flowing consistency of Sarcon® SG-26SL makes the grease ideal for power converter and…read more
Recent Posts
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