TIMs

Next-generation TIM Offers Double the Thermal Performance

June 1st, 2015

Dow Corning introduces a next generation thermal interface material (TIM 1) called the TC-3040 – which is a thermally conductive gel that delivers double the thermal performance of any other TIM in the industry. “TIM-1…read more

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Heat Sink Attachment Improves Heat Transfers and TIM Performance by 20 Percent

June 1st, 2015

Advanced Thermal Solutions, Inc. introduces the clipKIT – a heat sink attachment system available from Digi-Key. The clipKIT can be used with mostly any industry standard heat sink, such as straight fin, pin fin, cross…read more

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Application of Low Melt Alloys as Compliant Thermal Interface Materials: A Study of Performance and Degradation under Thermal Duress

May 20th, 2015

By: Chandan K. Roy1, Sushil Bhavnani1, Michael C. Hamilton2, R. Wayne Johnson3, Roy W. Knight1, & Daniel K. Harris1 1 Department of Mechanical Engineering, Auburn University, Auburn, AL 2 Department of Electrical and Computer Engineering,…read more

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Free Giveaway for Naming TIM or Connector Products

April 24th, 2015

Fujipoly is hosting a gift giveaway. On June 5, an engineer will win his/her choice of a free Samsung Galaxy Tab Pro, Apple iPhone 6, or a $500 American Express Giftcard, in Fujipoly America Corporation’s…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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Summary of ‘Thermal Interface Materials Predictions 2015-2025’

April 7th, 2015

A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.  “The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated…read more

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New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

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Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

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Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

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New TIM Improves Cooling Performance

February 19th, 2015

Fujipoly America Corporation introduces its new Sarcon 250G-HF2d thermal interface material. This TIM is made of reinforced nylon mesh and a low-tac surface treatment to prevent die-cut holes from collapsing. The Sarcon 250G-HF2d improves cooling…read more

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New Thermal Gaskets Easily Transfer Heat

December 9th, 2014

Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more

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Carbon Based Thermal Interface Material for High Performance Cooling

December 2nd, 2014

Ioan Sauciuc, Jelena Culic-Viskota, Intel Corporation  Rei Yamamoto, Michiaki Yajima, Hitachi Chemical Abstract— The focus of this paper is on the development of a novel thermal interface material (TIM) called Vertical Carbon TIM (VCTIM). This…read more

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THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

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Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

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