TIMs

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

Composite Metal Is 40 Percent Lighter than Steel with Eightfold Thermal Conductivity

June 30th, 2014

Materion Technical Materials has announced the release of eStainless, a new composite material comprised of a lightweight, highly conductive aluminum core within an outer skin of ductile stainless steel. eStainless maintains 83 percent of the…read more

New Dispensable Thermal Pads Now Available in Europe

June 27th, 2014

 Ellsworth Adhesives Europe, a distributor of adhesives and specialty chemicals, has announced the release of Dow Corning’s newest series of dispensable thermal pads into the European market. The new dispensable thermal pads are specially designed…read more

Thermal Adhesive Tape Reduces PCB Production Time

June 18th, 2014

Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the…read more

Thermal Interface Material Suits Component-Heavy Circuit Boards

June 4th, 2014

Fujipoly has released SARCON SPG-30A, a thermal interface material ideal for circuit boards with a large surface area, numerous components and delicate solder points. Featuring high viscosity and ultra-low compression force, the form-in-place silicone compound…read more

New TIM Boosts Performance Over Thermal Greases

May 23rd, 2014

Indium Corporation has announced the release of its new Heat-Spring® thermal interface material, which  was featured at PCIM this month in Nuremberg, Germany. Heat-Spring is a patented technology designed to deliver superior performance compared to…read more

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost

April 4th, 2014

3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

High Thermal Conductivity Thin Film

April 3rd, 2014

Fujipoly America has announced Sarcon 30-YR-a Thin Film, a new high performance thermal interface material. Measuring just 0.3mm thick, the Sarcon 30-YR-a thin film exhibits a thermal conductivity of 2.2 W/m°K with a thermal resistance…read more

Thermally Conductive Copper Grease for High-Temp Heat Transfer

March 21st, 2014

Aremco has released Heat-Away 640, a new high temperature, thermally conductive, copper-filled grease for use in heat transfer applications from –60 to 550 ºF (-51 to 288 ºC). Designed to improve the thermal transfer between…read more

Bergquist Talks TIMs at Semi-Therm 30

March 14th, 2014

Form-in-Place Thermal Compound for Delicate or Low Compression Requirements

March 11th, 2014

Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more