New Thermal Interface Material Introduced

March 23rd, 2015

Fujipoly America Corporation introduces the Sarcon SG-26SL, a new thermal interface material. The Sarcon SG-26SL is easy to apply, thermally conductive, silicone-based, and electrically non-conductive. This TIM offers thermal conductivity of 2.6 W/m°K, an operation…read more

Posted in New Products, TIMs | Comments Off

Company Hosts Workshop and Announces New Products

March 13th, 2015

Honeywell Electronic Materials (HEM) will make a new product announcement during SEMI-THERM 2015. Honeywell also recently announced its TIMS are being integrated into the production of Video Graphic Array cards to help them stay cool…read more

Posted in New Products, News, TIMs | Comments Off

Nutella used as a Thermal Paste

February 20th, 2015

On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more

New TIM Improves Cooling Performance

February 19th, 2015

Fujipoly America Corporation introduces its new Sarcon 250G-HF2d thermal interface material. This TIM is made of reinforced nylon mesh and a low-tac surface treatment to prevent die-cut holes from collapsing. The Sarcon 250G-HF2d improves cooling…read more

Posted in New Products, TIMs | Comments Off

New Thermal Gaskets Easily Transfer Heat

December 9th, 2014

Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more

Posted in Heat Exchanger, Heat Sinks, New Products, TIMs | Comments Off

Carbon Based Thermal Interface Material for High Performance Cooling

December 2nd, 2014

Ioan Sauciuc, Jelena Culic-Viskota, Intel Corporation  Rei Yamamoto, Michiaki Yajima, Hitachi Chemical Abstract— The focus of this paper is on the development of a novel thermal interface material (TIM) called Vertical Carbon TIM (VCTIM). This…read more

Posted in TIMs | Comments Off


November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

Posted in New Products, News, TIMs | Comments Off

New TIMs made of Soft Materials

November 10th, 2014

Two students at Texas A&M University, along with assistant professor of chemical engineering, Dr. Mustafa Akbulut, have announced new thermal interface materials they have produced in a project funded by DARPA. These TIMs have “a…read more

Posted in New Products, News, TIMs | Comments Off

New Thermal Management Material Produced

October 27th, 2014

Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more

Posted in New Products, Semiconductor, TIMs | Comments Off

Company’s Materials Aid in Production of Smartphones and Tablets

October 9th, 2014

Honeywell Performance Materials and Technologies has just announced its thermal interface materials have been used by other manufacturers to contribute towards the production of electronic devices. Because of Honeywell’s materials, these electronic devices have been…read more

Posted in Consumer, New Products, TIMs | Comments Off

One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Highly Conformable TIM Line Expanded with 1.0 mm Sheet

August 7th, 2014

Fuijipoly has announced the expansion of its Sarcon XR-Pe thermal interface material line with the availability of a 1.0 mm thick sheet. Requiring low compression force to conform to most CPU and semiconductor shapes, Sarcon…read more

Posted in New Products, TIMs | Comments Off

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

Posted in Industrial, LED / Lighting, New Products, Power, TIMs | Comments Off