AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more
Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability
April 17th, 2014
New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost
April 4th, 2014
3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as…read more
Polymer-Based Thermal Interface Material Cools Devices at 200°C
April 3rd, 2014
Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more
High Thermal Conductivity Thin Film
April 3rd, 2014
Fujipoly America has announced Sarcon 30-YR-a Thin Film, a new high performance thermal interface material. Measuring just 0.3mm thick, the Sarcon 30-YR-a thin film exhibits a thermal conductivity of 2.2 W/m°K with a thermal resistance…read more
Thermally Conductive Copper Grease for High-Temp Heat Transfer
March 21st, 2014
Aremco has released Heat-Away 640, a new high temperature, thermally conductive, copper-filled grease for use in heat transfer applications from –60 to 550 ºF (-51 to 288 ºC). Designed to improve the thermal transfer between…read more
Form-in-Place Thermal Compound for Delicate or Low Compression Requirements
March 11th, 2014
Fujipoly has released SARCON SPG-50A, a form-in-place gap filler material with a thermal conductivity of 5.0 W/m°K. Exhibiting ultra-low compression force, the new silicone-based compound is ideal for applications that have delicate components or low…read more
Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation
March 10th, 2014
Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more
Expanded Product Catalog Features New Thermal Interface Materials
March 6th, 2014
Fujipoly has released its new thermal interface material and elastomeric connector product catalog. The 52-page product overview and technical guide includes design guidelines as well as detailed thermal performance and electrical conductivity data points. Several…read more
Thermal Pad Offers Advantages of Thermal Grease Without Mess
March 3rd, 2014
AOS Thermal Compounds has released Micro-Faze, a new thermal interface material formulated with non-silicone thermal grease. Micro-Faze offers a number of technical advantages, including low thermal resistance with minimum force and conformance with coefficient of…read more
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
February 28th, 2014
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more
Towards Reproducible ASTM D5470 Measurements at Lower Cost
February 28th, 2014
Baratunde A. Cola Georgia Institute of Technology INTRODUCTION ASTM D5470 (updated to ASTM D5470-12 in 2012) [1] remains an industry standard for characterizing thermal interface materials (TIMs) despite some drawbacks. Ultimately, a TIM must be…read more
Carbon Nanotubes Boost Microprocessor Cooling
February 4th, 2014
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more
PCMA Thermal Interface for Intel Core LGA-115x Processors
February 4th, 2014
Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a…read more
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