On February 5, which was World Nutella Day, Cool Master celebrated the hazelnut-chocolate spread by using Nutella as a thermal paste. The firm heated the Nutella first and cleaned the CPU before applying the spread.…read more
New TIM Improves Cooling Performance
February 19th, 2015
Fujipoly America Corporation introduces its new Sarcon 250G-HF2d thermal interface material. This TIM is made of reinforced nylon mesh and a low-tac surface treatment to prevent die-cut holes from collapsing. The Sarcon 250G-HF2d improves cooling…read more
New Thermal Gaskets Easily Transfer Heat
December 9th, 2014
Fujipoly America Corporation has announced its new die-cut thermal interface gaskets. The gaskets easily transfer heat from electronic devices and components to the environment. The die-cut shape allows the gaskets to fit mostly any application.…read more
Carbon Based Thermal Interface Material for High Performance Cooling
December 2nd, 2014
Ioan Sauciuc, Jelena Culic-Viskota, Intel Corporation Rei Yamamoto, Michiaki Yajima, Hitachi Chemical Abstract— The focus of this paper is on the development of a novel thermal interface material (TIM) called Vertical Carbon TIM (VCTIM). This…read more
THERMAL LIVE 2015
November 25th, 2014
THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more
Thermal Test Chip Assists in TIM Testing
November 24th, 2014
Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more
New TIMs made of Soft Materials
November 10th, 2014
Two students at Texas A&M University, along with assistant professor of chemical engineering, Dr. Mustafa Akbulut, have announced new thermal interface materials they have produced in a project funded by DARPA. These TIMs have “a…read more
New Thermal Management Material Produced
October 27th, 2014
Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more
Company’s Materials Aid in Production of Smartphones and Tablets
October 9th, 2014
Honeywell Performance Materials and Technologies has just announced its thermal interface materials have been used by other manufacturers to contribute towards the production of electronic devices. Because of Honeywell’s materials, these electronic devices have been…read more
One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries
August 7th, 2014
Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more
Highly Conformable TIM Line Expanded with 1.0 mm Sheet
August 7th, 2014
Fuijipoly has announced the expansion of its Sarcon XR-Pe thermal interface material line with the availability of a 1.0 mm thick sheet. Requiring low compression force to conform to most CPU and semiconductor shapes, Sarcon…read more
Phase-Change TIM Offers Good Alternative to Grease
July 7th, 2014
Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more
Composite Metal Is 40 Percent Lighter than Steel with Eightfold Thermal Conductivity
June 30th, 2014
Materion Technical Materials has announced the release of eStainless, a new composite material comprised of a lightweight, highly conductive aluminum core within an outer skin of ductile stainless steel. eStainless maintains 83 percent of the…read more
New Dispensable Thermal Pads Now Available in Europe
June 27th, 2014
Ellsworth Adhesives Europe, a distributor of adhesives and specialty chemicals, has announced the release of Dow Corning’s newest series of dispensable thermal pads into the European market. The new dispensable thermal pads are specially designed…read more
Recent Posts
- Electronics Cooling March 2015 Issue Now Online
- Understanding Semiconductor Technology and Business
- Nutella used as a Thermal Paste
- Graphene Improves Anti-Corrosion Coatings
- Ultra-thin and Flexible Thermal Management Device to be Commercialized
- Universal Cooler Ideal for Tilting Luminaires
- New TIM Improves Cooling Performance
- Bendable Heat Pipes Ideal for Space-limited Applications
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