TIMs

Thermal Innovations Win Award and Industry Recognition

April 25th, 2016

(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the…read more

Posted in Materials, Compounds, Adhesives, Substrates, News, TIMs | Comments Off on Thermal Innovations Win Award and Industry Recognition

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

Posted in Articles, Design, Heat Pipes, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, TIMs | Comments Off on iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

Posted in Automotive, Communications, Enclosures, Heat Sinks, IT Products, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on New TIMs That Offer High Thermal Conductivity

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

New High-Performance Thermal Interface Thin Film

March 1st, 2016

Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c. The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor…read more

Posted in Computer, Heat Sinks, New Products, Semiconductor, TIMs | Comments Off on New High-Performance Thermal Interface Thin Film

Compressible, Recyclable, Metal TIM for LED Manufacturing

February 15th, 2016

The Indium Corporation will feature Heat-Spring®, their new compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, California. The Heat-Spring® interface provides 86 W/mK of thermal conductivity using…read more

Posted in LED / Lighting, New Products, TIMs | Comments Off on Compressible, Recyclable, Metal TIM for LED Manufacturing

Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

New High-Performance, Conforming TIM

February 1st, 2016

Fujipoly America has just introduced its newest high-performance, low compression force putty-like thermal interface material, Sarcon PG80A. The TIM’s “13 W/m°K gap filler pad gently conforms to most component shapes and uneven surfaces to transfer…read more

Posted in New Products, TIMs | Comments Off on New High-Performance, Conforming TIM

New Soft TIM with Low Thermal Resistance

November 23rd, 2015

Fujipoly recently introduced the Sarcon® GR80A, which is a soft thermal interface material that also has a low thermal resistance. According to the company, the thermal interface material is available in sheets from 0.3mm to…read more

Posted in New Products, TIMs | Comments Off on New Soft TIM with Low Thermal Resistance

New Thermal Management Material for Semiconductors

October 19th, 2015

Honeywell Electronic Materials has announced the availability of a new thermal management material for semiconductors – the Honeywell PTM6000 Phase Change Material (PCM). The PTM6000 was designed to meet both high performance needs and long…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor, TIMs | Comments Off on New Thermal Management Material for Semiconductors

TIM with EMI Absorption Capabilities Announced

August 24th, 2015

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more

Posted in Automotive, Consumer, LED / Lighting, New Products, TIMs | Comments Off on TIM with EMI Absorption Capabilities Announced

New TIMs for ECUs and Embedded Systems Cooling

August 12th, 2015

Fujipoly America Corporation introduces an assortment of TIMs for commercial and military vehicle ECUs and embedded systems cooling. “The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly…read more

Posted in New Products, TIMs | Comments Off on New TIMs for ECUs and Embedded Systems Cooling

Three New Lines of TIMs Offer High Thermal Conductivity

August 12th, 2015

Aavid Thermalloy introduces three new lines of high-performance thermal interface materials – thermally conductive gap fillers. The three lines include the SuperThermal™, SoftFlex™, and WaveBlocker™. These product lines offer very high thermal conductivity without compromising…read more

Posted in New Products, TIMs | Comments Off on Three New Lines of TIMs Offer High Thermal Conductivity

New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

Posted in Computer, Design, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on New Heat Transfer Tapes Offer Advanced Thermal Management