TIMs

THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

Thermal Test Chip Assists in TIM Testing

November 24th, 2014

Thermal Engineering Associates, Inc. has introduced its new Thermal Test Chip, the TTC-1001. This chip “has capability of supplying a power density of 261W/cm2 for performing Thermal Interface Material (TIM) testing, evaluating package thermal characteristics,…read more

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New TIMs made of Soft Materials

November 10th, 2014

Two students at Texas A&M University, along with assistant professor of chemical engineering, Dr. Mustafa Akbulut, have announced new thermal interface materials they have produced in a project funded by DARPA. These TIMs have “a…read more

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New Thermal Management Material Produced

October 27th, 2014

Element Six has introduced its new thermal grade of CVD Diamond, named the Diafilm TM130. This CVD Diamond’s main purpose is management of semiconductor heat. The Diafilm TM130, which was grown by chemical vapor deposition,…read more

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Company’s Materials Aid in Production of Smartphones and Tablets

October 9th, 2014

Honeywell Performance Materials and Technologies has just announced its thermal interface materials have been used by other manufacturers to contribute towards the production of electronic devices. Because of Honeywell’s materials, these electronic devices have been…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Highly Conformable TIM Line Expanded with 1.0 mm Sheet

August 7th, 2014

Fuijipoly has announced the expansion of its Sarcon XR-Pe thermal interface material line with the availability of a 1.0 mm thick sheet. Requiring low compression force to conform to most CPU and semiconductor shapes, Sarcon…read more

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Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

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Composite Metal Is 40 Percent Lighter than Steel with Eightfold Thermal Conductivity

June 30th, 2014

Materion Technical Materials has announced the release of eStainless, a new composite material comprised of a lightweight, highly conductive aluminum core within an outer skin of ductile stainless steel. eStainless maintains 83 percent of the…read more

New Dispensable Thermal Pads Now Available in Europe

June 27th, 2014

 Ellsworth Adhesives Europe, a distributor of adhesives and specialty chemicals, has announced the release of Dow Corning’s newest series of dispensable thermal pads into the European market. The new dispensable thermal pads are specially designed…read more

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Thermal Adhesive Tape Reduces PCB Production Time

June 18th, 2014

Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the…read more

Thermal Interface Material Suits Component-Heavy Circuit Boards

June 4th, 2014

Fujipoly has released SARCON SPG-30A, a thermal interface material ideal for circuit boards with a large surface area, numerous components and delicate solder points. Featuring high viscosity and ultra-low compression force, the form-in-place silicone compound…read more

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New TIM Boosts Performance Over Thermal Greases

May 23rd, 2014

Indium Corporation has announced the release of its new Heat-Spring® thermal interface material, which  was featured at PCIM this month in Nuremberg, Germany. Heat-Spring is a patented technology designed to deliver superior performance compared to…read more

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Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

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