Mentor Graphics Blog

Top 10 FloTHERM V10 Features – #4: Updated CAD

June 4th, 2014

FloTHERM’s strength has always its been its robustness, founded on a simplicity of technology that we’ve tried not to compromise over its 25 year life. This is no truer than in its 3D CAD drawing…read more

Top 10 FloTHERM V10 Features – #3: FEA Interfacing

June 3rd, 2014

Temperature has always been, and will continue to be, a good enough leading indicator of product reliability. As a parameter it is easy to specify a maximum rating value and relatively easy to measure. However…read more

Ramping Up for THERMINIC! Abstract Deadline 28th May 2014

May 16th, 2014

The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed.…read more

Top 10 FloTHERM V10 Features – #2: Advanced Find

February 25th, 2014

Electronic products, and products that contain electronics, are typified by being constructed of 100s if not 1000s of individual parts. A CPU alone is the most complex manufactured product on earth as demonstrated in this…read more

Top 10 FloTHERM V10 Features – #1: New GUI

February 14th, 2014

FloTHERM V10 is a major release that marks 25 years as the leading electronics thermal simulation tool. This series will introduce the top 10 features that we’ve delivered, hopefully giving some insights not just on…read more

Happy 25th Birthday FloTHERM !

November 14th, 2013

Late in 1988 two key employees of CHAM (Concentration Heat And Momentum Ltd.), the first commercial CFD vendor and at the time market leader, left to set up a new type of CFD company. Recognising…read more

Why Not Just Shove a Heatsink on Top of it? Part 3: Pads, Vias and Undersinking

July 5th, 2013

An appreciation of heat flow paths is a pre-requisite for good thermal design. If you attempt to augment heat flow where there is none then your expectations are as futile as your design skills. The…read more

Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets

May 15th, 2013

Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of…read more

Why Not Just Shove a Heatsink on Top of it? Part 1

May 13th, 2013

A common enough question. Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. They should be called ‘area extenders’ as heat does not just disappear into them. Heat spreads throughout…read more

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

April 19th, 2013

In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary…read more

Experiment vs. Simulation, Part 4: Compact Thermal Models

April 8th, 2013

Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative and conductive affects are considered concurrently. Back in the day much talk was had about…read more

CFD – Colourful Friday Distractions

April 8th, 2013

By way of an apology for the more verbose blogs I’ve been issuing recently I’d like to present you with a blog that serves no other purpose than to show a pretty picture. CFD as…read more

Experiment vs. Simulation, Part 3: JESD51-14

February 22nd, 2013

The JESD51-14 standard was published in November 2010, prepared by the JEDEC JC-15 Committee on Thermal Characterization. It outlines a new process to measure what is the most common IC package thermal metric, Theta_jc. This…read more

Experiment vs. Simulation, Part 1: Them and Us.

January 18th, 2013

Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on getting things this far, some of it on you via your overhead and your expansive…read more