JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex's global mass production capabilities. As AI training and inference workloads accelerate, silicon power densities are advancing into sustained … [Read more...]
Johnson Controls to Acquire Alloy Enterprises
Johnson Controls, a global technology leader in energy efficiency, decarbonization, thermal management and mission-critical performance, has signed an agreement to acquire Alloy Enterprises, a Boston-based company specializing in a next-generation thermal management platform for high-performance data centers and other mission critical industrial applications. The move will … [Read more...]
Highlights From the 19th ASME InterPACK Conference
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
Sheetak Solves Micro-Scale Hotspots with New µCENTUM™ Thermoelectric Coolers
High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX - To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact solid-state devices deliver powerful, component-level cooling to uphold … [Read more...]
THERMINIC 2025: A Landmark Workshop on Thermal Management and Electronics Reliability
The 31st international workshop on THERMal INvestigations of ICs and systems (THERMINIC) took place on 24–26 September 2025 in Naples, Italy, hosted at the Centro Congressi (Conference Center) of University Federico II. This year’s workshop not only broke attendance records but also showcased the seamless integration of cutting-edge research and industrial innovation in the … [Read more...]
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