The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Modifying Sample Size
ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples by subjecting them to a more severe level of testing. BACKGROUND Reliability verification often includes … [Read more...]
Statistics Corner: Probability
Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine with additional measurements. Statistical analysis uses the mathematics of probability to create tools that we can use to deal with … [Read more...]
Sheetak Announces Product Line Expansion with CENTUM® C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures
CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs January 10, 2023 AUSTIN, TX--Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
- « Previous Page
- 1
- 2
- 3
- 4
- 5
- …
- 122
- Next Page »
