Don’t miss out on the June 2011 issue of ElectronicsCooling, which includes feature articles on predicting reliability of outdoor cellular electronics using realistic environmental conditions, thermal management solutions and generating the thermal resistance matrix, as…read more
Intel Interview Outlines Computer Growth for 2011
May 3rd, 2011
ElectronicsCooling Business Bulletin Volume 1 | May 2011 First, welcome to the debut issue of the ElectronicsCooling Business Bulletin. Once a month we’ll publish information to help you to grow your thermal management business. You…read more
Posted in Design | No Comments »
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
Posted in Calculation Corner, Data Centers, Editorial, Heat Sinks, Liquid Cooling, Technical Brief, Technical Data | 1 Comment »
technical brief: thermal bottlenecks and shortcut opportunities; innovations in electronics thermal design simulation
September 13th, 2010
Introduction Cooling an electronics system involves transferring heat from various heat sources to the outside ambient. Thermal simulation software provides practitioners with predictions of the temperature and heat flux distributions in and around the system,…read more
Posted in Technical Brief | 1 Comment »
Electronics Cooling for Military Environments
May 25th, 2010
Allen Vanguard’s Electronic Protection with Integrated Cooling (EPIC) is a customized E-cooling system that protects electronic systems from the severe heat and harsh operating environments found in military environments, including vehicle electronics. It complies with…read more
Posted in Defense, Industries, New Products | No Comments »
ElectronicsCooling Spring 2010 Print Issue
April 30th, 2010
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in…read more
Posted in Applications, Automotive, Computer, Consumer, Coolers, Design, Heat Sinks, Industries, IT Products, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | 2 Comments »
electronics cooling in the automotive environment
April 30th, 2010
Introduction By 2008 the electronics content of a typical consumer vehicle had grown to 20-25% of the total vehicle cost [1]. This content provides a wide range of functions and features for today’s driver. Some…read more
Posted in Applications, Automotive, Industries, Materials, Compounds, Adhesives, Substrates | No Comments »
ITEM Publications revives ElectronicsCooling magazine
April 9th, 2010
ITEM Publications, the publisher of electronics engineering journals, today announced the return of ElectronicsCooling magazine.
Posted in News | No Comments »
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Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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