Don’t miss out on the June 2011 issue of ElectronicsCooling, which includes feature articles on predicting reliability of outdoor cellular electronics using realistic environmental conditions, thermal management solutions and generating the thermal resistance matrix, as well as technical briefs.
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Read the June 2011 issue here.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





