Future Facilities Incorporated recently released a case study showing that its new CFD software for electronics cooling design, 6SigmaET, solves the problem of how to shrink electronics devices that generate heat. The study describes how Advanced Thermal Solutions-Europe, BV used Future Facilities’ 6SigmaET software to model lamp performance while simultaneously reducing heat sink cost, selecting the optimal high-performance coating for the LED’s heat sink, and matching the LED to the correct circuit board.
Download the case study from Future Facilities.
Author
-
View all posts
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





