Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more
Heat Spreading Calculations Using Thermal Circuit Elements
August 1st, 2008
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Compact thermal modeling in electronics design
May 1st, 2007
Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more
Posted in Design, Test & Measurement | No Comments »
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »
A Funny Thing Happened On The Way To The Heatsink
August 1st, 2005
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more
Posted in Calculation Corner, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »
Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis
May 1st, 2004
Introduction Heat transfer in and around a printed circuit board (PCB) is generally very complex. Some of the heat generated in components is conducted away through the multiple conducting (trace) layers, vias, and dielectric layers…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
The 45° Heat Spreading Angle – An Urban Legend?
November 1st, 2003
Ever hear about the 45° heat spreading angle? Most of us have. However, no one I’ve talked to seems to know where it came from. Is it an urban legend, such as alligators in the…read more
Posted in Calculation Corner, Design, Standards, Test & Measurement | No Comments »
Thermomechanical stress modeling in microelectronics and photonics
November 1st, 2001
Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more
Posted in Design, Technical Brief, Test & Measurement | No Comments »
High accuracy thermal interface resistance measurement using a transient method
September 1st, 2000
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal analysis moves into the 21st century
January 1st, 2000
In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being challenged…read more
Posted in Design, Software | No Comments »
Safety tips and techniques for FEA in modeling solids
June 1st, 1995
Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful.…read more
Posted in Design, Software, Test & Measurement | No Comments »
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