United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more
Connector/Decoupler Integrated in a Heat Sink
April 11th, 2011
Posted in Heat Sinks, News | No Comments »
A Simple Method to Estimate Boiling Heat Sink Performance
February 1st, 2009
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
February 1st, 2008
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more
Posted in Calculation Corner, Design, Heat Sinks | No Comments »
Future trends in heat sink design
February 1st, 2001
In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more
Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 1 Comment »
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