Posts tagged Heat Flow

Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board

November 1st, 2004

Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more

Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | Comments Off

Tags: , , , , ,

Thermal Vias – A Packaging Engineer’s Best Friend

August 1st, 2004

Introduction In the 1990’s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more

Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »

Tags: , , , , , ,

Convection and radiation heat loss from a printed circuit board

September 1st, 1998

In last issue’s column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from…read more

Posted in Calculation Corner, Design, Test & Measurement | Comments Off

Tags: , , , ,

One-dimensional heat flow

September 1st, 1997

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face.…read more

Posted in Calculation Corner, Design, Test & Measurement | Comments Off

Tags: