Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »
Convection and radiation heat loss from a printed circuit board
September 1st, 1998
In last issue’s column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
One-dimensional heat flow
September 1st, 1997
The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face.…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
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