Professor Cristina Amon, dean of the University of Toronto’s Faculty of Applied Science & Engineering, has received the 2011 Society of Women Engineers Achievement Award, the highest award given by the Society, for her outstanding…read more
Dean Receives the Society of Women Engineers’ Highest Honor
December 12th, 2011
Posted in Liquid Cooling, News, Test & Measurement | No Comments »
Thermal Solver with Heat Transfer Simulation Package
November 21st, 2011
MAYA HTT’s TMG-Thermal solver provides a comprehensive heat transfer simulation package, which allows fast and accurate solutions to complex thermal problems. Using finite difference control volume technology, TMG-Thermal makes it easy to numerically simulate nonlinear…read more
Posted in New Products, Test & Measurement, TIMs | No Comments »
New Air-Cooling Technology Reduces Energy Use
July 11th, 2011
Sandia National Laboratories has developed a proprietary air-cooling invention, the “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger.” The Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool…read more
Posted in Heat Sinks, New Products | No Comments »
Textbook covers basic heat transfer theory, practical guidelines
April 6th, 2010
“Heat Transfer: Thermal Management of Electronics,” a reference and textbook by Dr. Younes Shabany, includes both basic heat transfer theory as well as practical guidelines for solving thermal design problems that are common to electronic…read more
Posted in Applications, Design, New Products | No Comments »
Data center cooling solutions cut energy consumption and costs
March 30th, 2010
Coolcentric™, a new division of Vette Corp.®, offers patented LiquiCool® technology in a variety of turnkey data center cooling system solutions that can reduce cooling unit energy consumption by up to 90 percent and lower…read more
Posted in Applications, Data Centers, Industries, Liquid Cooling, New Products | No Comments »
Direct Spray Cooling and System-level Comparisons
August 1st, 2009
Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a…read more
Posted in Aerospace, Applications, Defense, Design, Industries, Liquid Cooling | No Comments »
A Simple Method to Estimate Boiling Heat Sink Performance
February 1st, 2009
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
August 1st, 2008
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more
Posted in Heat Sinks, Technical Brief, Test & Measurement | No Comments »
Modeling Multiple Heat Source Problems In Electronic Systems
May 1st, 2008
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts…read more
Posted in Design, Test & Measurement | No Comments »
Microscale heat transfer
February 1st, 2007
Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick.…read more
Posted in Design, Test & Measurement | No Comments »
On-Chip Electrowetting Cooling
May 1st, 2006
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the…read more
Posted in Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Server Design Challenges for the High-heat-load Internet Data Center
February 1st, 2005
Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example,…read more
Posted in Blowers / Fans / Filters, Computer, Coolers, Data Centers, Design, Heat Sinks, Test & Measurement | No Comments »
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
November 1st, 2004
It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
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