New 8 V p-channel TrenchFET® power MOSFET has the lowest on-resistance achieved for a p-channel device in the thermally enhanced PowerPAK® SC-70 2 mm by 2 mm footprint area (16 mΩ at 4.5 V, 26…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Semiconductor | No Comments »
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