In its 28th year, SEMI-THERM will include Invited Speakers, Technical Sessions, Short Courses and an Evening Tutorial as well as vendor exhibits and dedicated vendor sessions for the latest in commercial offerings. SEMI-THERM actively solicits…read more
IEEE Components, Packaging and Manufacturing Technology Society
March 18th, 2011
The CPMT Society, as the principal sponsor of SEMI-THERM, invites professionals to consider joining the organization for networking, learning, and career development. Access SEMI-THERM papers from 1988 to 2010 at ieeexplore.ieee.org, using the Xplore search capabilities. Visit the group…read more
Posted in Test & Measurement | No Comments »
30 GHz Leadless Chip Carrier Packaging Platform
March 18th, 2011
Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more
Posted in Aerospace, Ceramics, Defense, Design | No Comments »
Thermal Company Partners With Packaging Services Firm
February 4th, 2011
Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS…read more
Posted in Heat Sinks, News, TIMs | No Comments »
Thermal Paper Draws Top Award at PCIM Conference
May 10th, 2010
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more
Posted in Applications, Industries, Liquid Cooling, News, Power | No Comments »
Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power
May 10th, 2010
Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other…read more
Posted in Computer, Industries, News | No Comments »
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
February 1st, 2009
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more
Posted in Design, Semiconductor | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
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- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
- Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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