Posts tagged Packaging

SEMI-THERM Announces Call for Papers

July 11th, 2011

In its 28th year, SEMI-THERM will include Invited Speakers, Technical Sessions, Short Courses and an Evening Tutorial as well as vendor exhibits and dedicated vendor sessions for the latest in commercial offerings. SEMI-THERM actively solicits…read more

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IEEE Components, Packaging and Manufacturing Technology Society

March 18th, 2011

The CPMT Society, as the principal sponsor of SEMI-THERM, invites professionals to consider joining the organization for networking, learning, and career development. Access SEMI-THERM papers from 1988 to 2010 at ieeexplore.ieee.org, using the Xplore search capabilities. Visit the group…read more

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30 GHz Leadless Chip Carrier Packaging Platform

March 18th, 2011

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more

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Thermal Company Partners With Packaging Services Firm

February 4th, 2011

Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS…read more

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Thermal Paper Draws Top Award at PCIM Conference

May 10th, 2010

A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more

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Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power

May 10th, 2010

Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other…read more

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When Moore Is Less: Exploring the 3rd Dimension in IC Packaging

February 1st, 2009

Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more

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