Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Posted in Applications, Heat Pipes, Heat Sinks, New Products | No Comments »
Thermal Paper Draws Top Award at PCIM Conference
May 10th, 2010
A paper on thermal aspects in power systems won a Young Engineer Award at this year’s PCIM (Power Electronics/Intelligent Motion/Power Quality) Europe Conference. The Young Engineer Award is presented to exceptional contributions from young professionals…read more
Posted in Applications, Industries, Liquid Cooling, News, Power | No Comments »
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | No Comments »
A Few Design Techniques On How To Reduce The Power
February 1st, 2003
There will always be the need to get heat out of high power circuitry, but with a little extra design effort up front, we may be able to reduce overall power needs. Here are two…read more
Posted in Aerospace, Design, Power, Technical Brief | No Comments »

