Posts tagged PQFP

Thermal interface under a plastic quad flat pack

May 1st, 1998

Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Plastics, Test & Measurement, TIMs | No Comments »

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