A team led by Dr Ole Martin Løvvik of Oslo University’s Centre for Materials Science and Nanotechnology in Norway has found a way of making cheap thermoelectric materials that could harvest waste heat from a…read more
Researchers Create Cheap Thermoelectric Materials
November 22nd, 2011
Posted in Materials, Compounds, Adhesives, Substrates, News, Test & Measurement | No Comments »
Thermal Management PCBs Solve Thermal Problems for LED Industry
June 13th, 2011
SinkPAD Corporation’s new SinkPADTM aluminum PCB technology are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications. SinkPADTM conducts heat out of…read more
Posted in LED / Lighting, New Products | No Comments »
Talk Tackles Challenges of LED Test Standards
April 22nd, 2011
Defining thermal resistance for LEDs is important as some LED vendors neglect the effect of radiant flux in their calculations, which results in better data than is actually achieved in the field, noted Mentor Graphics’…read more
Posted in LED / Lighting, News | No Comments »
Lowest Resistance, Zero Pump-Out Thermal Pad
December 14th, 2010
AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more
Posted in New Products | No Comments »
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
December 6th, 2010
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more
Posted in Calculation Corner, Heat Sinks | No Comments »
calculation corner: a spreadsheet based matrix solution for a thermal resistance network: part 1
September 13th, 2010
Ross Wilcoxon Rockwell Collins Cedar Rapids, Iowa A thermal resistance network analysis begins by defining discrete points within a system, known as nodes, and the thermal resistance between each set of nodes. Boundary conditions for…read more
Posted in Calculation Corner | 1 Comment »
transient dual interface measurement of the rth-jc of power semiconductor packages
September 13th, 2010
Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a…read more
Posted in | No Comments »
High-Performance Thermal Putty
May 10th, 2010
Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
integrating vapor chambers into thermal solutions
April 30th, 2010
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more
Posted in Applications, Heat Sinks, Technical Brief | 1 Comment »
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
May 1st, 2009
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more
Posted in Calculation Corner, Liquid Cooling | 2 Comments »
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
February 1st, 2008
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more
Posted in Calculation Corner, Design, Heat Sinks | No Comments »
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Semiconductor | No Comments »
A Funny Thing Happened On The Way To The Heatsink
August 1st, 2005
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more
Posted in Calculation Corner, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
February 1st, 2004
In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by…read more
Posted in Calculation Corner, Design, Heat Sinks, Test & Measurement | 1 Comment »
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
