Posts tagged Thermal Resistance

Researchers Create Cheap Thermoelectric Materials

November 22nd, 2011

A team led by Dr Ole Martin Løvvik of Oslo University’s Centre for Materials Science and Nanotechnology in Norway has found a way of making cheap thermoelectric materials that could harvest waste heat from a…read more

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Thermal Management PCBs Solve Thermal Problems for LED Industry

June 13th, 2011

SinkPAD Corporation’s new SinkPADTM aluminum PCB technology are a complete and effective solution to the challenges faced by the solid state lighting industry, specifically those with aluminum LED PCB applications. SinkPADTM conducts heat out of…read more

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Talk Tackles Challenges of LED Test Standards

April 22nd, 2011

Defining thermal resistance for LEDs is important as some LED vendors neglect the effect of radiant flux in their calculations, which results in better data than is actually achieved in the field, noted Mentor Graphics’…read more

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Lowest Resistance, Zero Pump-Out Thermal Pad

December 14th, 2010

AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more

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Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1

December 6th, 2010

Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more

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calculation corner: a spreadsheet based matrix solution for a thermal resistance network: part 1

September 13th, 2010

Ross Wilcoxon Rockwell Collins Cedar Rapids, Iowa A thermal resistance network analysis begins by defining discrete points within a system, known as nodes, and the thermal resistance between each set of nodes.  Boundary conditions for…read more

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transient dual interface measurement of the rth-jc of power semiconductor packages

September 13th, 2010

Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a…read more

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High-Performance Thermal Putty

May 10th, 2010

Fujipoly has released SARCON XR-Um-Al, a thermal interface silicone putty. The gap filler compound’s putty-like consistency contributes to the material’s low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k. SARCON XR-Um-Al…read more

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integrating vapor chambers into thermal solutions

April 30th, 2010

  Introduction   Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more

Posted in Applications, Heat Sinks, Technical Brief | 1 Comment »

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Using a Matrix Inverse Method to Solve a Thermal Resistance Network

May 1st, 2009

Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more

Posted in Calculation Corner, Liquid Cooling | 2 Comments »

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Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers

February 1st, 2008

Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more

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Cooling Options And Challenges Of High Power Semiconductor Modules

November 1st, 2006

Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more

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A Funny Thing Happened On The Way To The Heatsink

August 1st, 2005

Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more

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Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance

February 1st, 2004

In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by…read more

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