Some like it hot, others do not. And those others for sure include the designers of products that contain electronics. There is a growing need to educate designers who are involved with the undesired side-effects of heat-dissipating components. We often see the following situation. At some moment in time, it is ascertained that a product is getting too hot, and if it turns out … [Read more...]
Archives for May 2009
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]