Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of excellence” designation is a new indicator within Sapa’s thermal management business unit that will provide “dedicated thermal management … [Read more...]
Archives for 2012
U.S. DoD Plans to Implement Hot Water Liquid Cooling System into Major Data Center
The U.S. Department of Defense (DoD) is planning to implement a liquid cooling systems into one of its major data centers. Developed by liquid cooling solutions company Asetek Inc., the direct-to-chip liquid cooling technology employs hot water and ambient air to cool servers. “Hot water direct-to-chip liquid-cooling is a powerful approach that can capture more than 80 percent … [Read more...]
Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface
Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance Enhancement at Inorganic Heterointerfaces Using Nanomolecular Monolayers,” will lead to new advances in cooling computer chips and LED … [Read more...]
Editorial: An Exciting Time for Thermal Engineers
I am delighted to have the opportunity to write this editorial and follow in the footsteps of my illustrious colleagues at ElectronicsCooling, both past and present. In keeping with tradition, I would like to share some thoughts that have been on my mind recently. This is an exciting time to be a thermal engineer in the electronics industry. Our industry is experiencing … [Read more...]
Thermal Facts and Fairy Tales: Not Always Efficient
Reducing the power required to cool electronics has significant cost advantages and quantifying the potential improvements of one technology over another is a frequent theme in current electronics cooling literature. Developing life cycle cost models and assessing the current and projected future cost benefits of different thermal management technologies is a worthwhile … [Read more...]
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