Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more.
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Read the June 2012 issue here.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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