Schroff announced the new TE series thermoelectric cooler, which is designed to provide a reliable, low-maintenance cooling solution for small electronics enclosures. The unit’s filterless design and lack of refrigerant and compressor help reduce maintenance requirements. The compact thermoelectric cooler is available in 13 different models, offering cooling performances of … [Read more...]
Archives for August 2012
High Power, High Efficiency Cooling Fans and Impellers
NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in the medical and industrial field. The new R and F Series of high power cooling fans achieve better airflow performance and efficiency due to a new … [Read more...]
Thermoelectric “Heat Engine” Could Use Waste Heat to Cool Electronics
Researchers at Ohio State University studying a new magnetic effect that converts heat to electricity have discovered how to amplify it a thousand times over - a first step in making the technology more practical. The research team's ultimate goal is a low-cost and efficient solid-state engine that coverts heat to electricity. This research could enable electronic devices to … [Read more...]
Hardcore Computer Becomes LiquidCool
Hardcore Computer has changed its name to LiquidCool Solutions to better reflect the company’s new cooling technologies and corporate strategy. LiquidCool Solutions will discontinue manufacturing PCs, workstations and servers to focus on its liquid submersion technology for servers and high performance computers. Hardcore released the Liquid Blade server in 2010, which was the … [Read more...]
PLPCB Constructions with Greater Thermal Management
Electronic Interconnect (EI) announced the availability of Powerlink PLPCB constructions for electronic assemblies where thermal management/heat dissipation capabilities are desired. PowerLink technology enables power and control circuits, both heavy copper and standard copper, to reside on the same layer with interconnection between the circuits. Bus bars with multi-copper … [Read more...]