Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the June 2014 issue of Electronics Cooling, which includes feature articles on Solder Joint Lifetime of Rapidly Cycled LED Components; Advances in Vapor Compression Electronics Cooling; Challenges in Measuring Theta jc for High Thermal Performance Packages; and more.
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Read the June 2014 issue here.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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