Improving Thermal Performance and Device Reliability
September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics, has introduced IceKap™ P30000, a silicone-free, high performance thermal interface material (TIM) which takes advantage of a new polymer chemistry improving device reliability by reducing TIM “pump out.”
Semiconductor packaging design teams will realize improved device reliability from IceKap P30000’s reduced potential for thermal material pump out, while thermal design teams will achieve improved device performance from IceKap P30000’s extremely low thermal contact resistance and high thermal conductivity.
Formulated using a high-performance thermoplastic, IceKap P30000 can be used in demanding thermal applications to transfer ever-rising thermal loads away from MPU, GPU and MCU devices. Offering its greatest benefit in TIM 1.5 and TIM 1 applications, where the TIM material is located between the processor die and the heat dissipating component, IceKap P30000 may also be used in TIM 2 applications.
As an example, thermal greases are another class of TIMs. The conformability and thin bond line thickness of typical thermal greases can provide initial low thermal resistance. However, the performance of thermal greases can degrade over time due to pump out and dry out.
Compared to thermal greases and other available thermally conductive phase change materials, IceKap P30000 “combines its 5.5W/mK thermal conductivity, extremely low thermal contact resistance and unique thermoplastic polymer to provide the user with a high performance, highly reliable TIM,” says Mark Wisniewski, Laird product line director. “We believe this unique polymer is long overdue and can help boost the quality performance of larger processors.”
IceKap P30000 is solder-reflow compatible, inherently tacky and automatable. It survives board rework processing, enables the use of larger dies and promotes faster cycle times and more efficient production. It also can be pre-applied to components and stored for future shipment to device assemblers. Contact Laird to learn more and request samples at: https://www.laird.com/contact.
About Laird Performance Materials
Laird Performance Materials, an Advent International company with global headquarters in Shanghai, China, enables high-performance electronics. We create advanced protection solutions for electronic components and systems. World-leading technology brands rely on us for improved protection, higher performance and reliability, custom structural designs and faster time-to-market. We solve design issues through innovative products such as EMI suppression or absorption materials, thermal interface materials, structural and precision metals, magnetic ceramic products, and multi-functional solutions. This latter product family solves multiple EMI, thermal, and structural design issues simultaneously using a single process solution. Visit https://www.laird.com.
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