Days before the last issue of Electronics Cooling Magazine was published, we heard news that a significant contributor to our industry, Clemens Lasance, had passed away. Clemens was a long-time editor of this magazine, as well as contributing to the success of multiple conferences and technology developments while at Philips. Besides, Clemens served as a mentor to many of us … [Read more...]
Sheetak Strengthens U.S. Thermoelectric Manufacturing with Custom Solutions and Rapid Prototyping
Custom thermoelectric devices, faster prototypes, and reliable U.S. manufacturing for critical industries. Sheetak Inc., a U.S.-based leader in advanced thermoelectrics, is redefining solid-state cooling and energy management with fully customizable devices and rapid prototyping through its expanded U.S. manufacturing capabilities. Headquartered in Austin, Texas, Sheetak … [Read more...]
Rosenberg Introduces New 170W Ecofit EC Fans: More Cooling Power and Efficiency for Your Application
Rosenberg's new generation of Ecofit G9 EC motors offers an increased power rating of 170 watts, providing a higher-performance, more energy-efficient air movement solution. The new motor is available on 48 models of Ecofit backward-curved fans and forward-curved blowers. They provide improved ventilation without impacting the budget or increasing the energy footprint. Another … [Read more...]
Statistics Corner: Modifying Sample Size
Author’s note: This article was initially published in a compilation of some of the articles published in the Electronics Cooling Magazine ‘Statistics Corner’ [4]. However, it was never published as part of a standard ECM issue. Therefore, it seemed appropriate to reintroduce it to the readers to this series on statistical analysis methods. Abstract Reliability … [Read more...]
Performing a Transient Thermal Characterization of Hardware with a Finite Difference Model
Introduction A transient thermal characterization, also known as a thermal survey, aims to characterize the location of greatest thermal inertia within a hardware system—that is, the location with the slowest temperature response to a given environmental stimulus. This manuscript outlines a methodology for developing a finite difference numerical model of a three-resistor, … [Read more...]
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