Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being thin or lightweight are desired. There are two types of flexible graphite, natural and … [Read more...]
Three Reasons to Add Thermal Simulation to your Circuit Design Workflow
As wireless devices increase in complexity, the challenges around maintaining temperature control continue to mount. As smartphones, for example, require more and more transistors to fit into smaller spaces, there’s simply not as much space for the heat to dissipate. Wireless designers are tasked with finding new ways to keep these devices from overheating without … [Read more...]
Cool Information from Fujipoly
Carteret, NJ —Tuesday, January 21, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material performance datasheets. The whitepapers cover topics such as the Compression … [Read more...]
Tough Epoxy Polysulfide Adhesive Resists High Temperatures
Product: EP21TPHT Release Date: 01/14/2020 Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient … [Read more...]
Thermal Interactions between High-power Packages and Heat Sinks, Part 2
Calculation Corner Bruce Guenin, Assoc. Technical Editor Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the … [Read more...]
