As electric and hybrid electric vehicles address the world’s energy and emissions crises, automakers and battery manufacturers are rapidly developing new materials and solutions to advance those technologies. Consumer demands and competitive pressures have led automakers to add a growing number of functions and features to their vehicles, which in turn affects … [Read more...]
Groups Develop Thermal Nanotape for Packaging
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
New Thermoelectric Module for Photonics Cooling
Nextreme Thermal Solutions recently introduced the OptoCooler HV37 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address photonics cooling applications with larger heat pumping requirements. At 85°C, the OptoCooler HV37 can pump 4.5 watts or 107W/cm2 of heat in footprint of only 6 mm2. The device is only 0.6mm … [Read more...]
Beer Fridge – A Case Study in Thermal Design. Part 5 – Time for a FloBEER
All good things come to those who wait. For beer this entails a trade off between anticipation and satisfaction. If, too soon after you put the room temperature beer in the fridge, you get your child to grab a beer for you, your thirst might be quenched but your satisfaction might not be. Wait too long for it to cool down and you might forget you wanted one, or go to sleep, or … [Read more...]
Novel Thermally Enhanced Power Package
In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, … [Read more...]
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