A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead to a new way of producing electricity, the researchers say. The phenomenon, described as thermopower waves, is such a new discovery that it’s … [Read more...]
Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power
Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The platform has been repartitioned to include the Intel Atom processor Z6xx, which … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
thermal facts and fairy tales: most of us live neither in wind tunnels nor in the world of Nusselt
Having read myriad papers/articles/books/reports on thermal management, I feel there is a lot of misunderstanding about what really should drive a sound approach of how to tackle the thermal problems that tend to land on the desk of thermal designers. I also have the feeling that many “how to” articles presented on the Web are just meant to show off the knowledge of the author … [Read more...]
integrating vapor chambers into thermal solutions
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that normal heat sink materials, aluminum or copper, are either insufficient or too bulky to meet the design objectives, the obvious next step is to look at two phase … [Read more...]
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