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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

Utilizing Boyd Coolant Distribution Units (CDUs)

 

Introduction Let's begin with two images that may be familiar, but will provide a very good illustration to help us frame the current market trend and why liquid cooling is on the rise. The two charts in Figure 1 show actual CPU and GPU power consumption over the years, and Figure 2 shows an overall trend in chip power. As we can see here at this point, in 2023 at 700 … [Read more...]

Designing with MLPS Part 2

 

Let's Dive Into the Why of MLPS To save assembly time, our modular light pipe system comes preassembled in rail and tower system (RT), and Rail, Tower, Bezel (RTB) formats. RT provides an easier way of coupling LEDs mounted in the PC board with light pipes for efficient light transmission. RTB includes a vessel that mounts on the back of the panel, helps with light pipe … [Read more...]

Designing with MLPS Part 1

 

Introduction Modular light pipe systems, specifically Bivar's new MLPS, communicate more data these days, it is very difficult if you do not have a few LEDs on the panel. For example, in a control system environment, like in AI, such as echo devices and other similar devices. Also in robotics, there's a lot of indication available, which does let you see the status on the … [Read more...]

Sheetak Announces Product Line Expansion with CENTUM® C3 Multi-Stage Cooler Based on Novel Patented Thermoelectric Device Structures

 

CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and … [Read more...]

Advanced SAM Validates Integrity of Diffusion Bonds

 

For bond quality testing, Scanning Acoustic Microscopy offers far greater accuracy and reliability than traditional helium leak testing Introduction Industries with demanding metal bonding applications are increasingly relying on diffusion bonding, an essential joining method for achieving a high-purity interface between two similar or even dissimilar metals. The process … [Read more...]

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