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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

Hydraulic and Thermal Characteristic of a Double-Sided Cold Plate. Part 1: CFD Analysis

 

Introduction Many programs geared toward the design of autonomous vehicles have been initiated in recent years. Waymo, Cruise, Baidu, Argo AI, Uber, Lyft, and Tesla are among the innovative self-driving car companies. Advances in autonomous technologies will require enhanced thermal protection of critical electronics to ensure optimized performance, health, and … [Read more...]

Generative Design and Advanced 3D Printing: A Copper CPU Cooler with 55% Lower Thermal Resistance

 

Introduction Effective cooling is essential for CPUs, as they generate significant heat during operation while being very temperature sensitive. Improved cooling allows for maintaining the functionality of high-performance computer hardware. In this article, we demonstrate a unique approach to improving the cooling of high-performance components by combining thermal and … [Read more...]

Network Implementation of Advective Thermal Conductances

 

Overview Accurate modeling of thermal networks requires that all relevant modes of heat transfer, including advection, be included. Otherwise, component temperatures may be under- or over-estimated. This article presents a method for systematically including advection in one-dimensional (1D) thermal networks, via the use of unidirectional elements in the thermal network … [Read more...]

Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center

 

Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for its Manila, Philippines, colocation data center. Using the patented StatePoint technology - an industry-leading sustainable cooling solution for … [Read more...]

Duocel® Metal Foam Heat Exchangers

 

Introduction As power-component technology advances and smaller packaging is required, thermal-management issues threaten to limit the performance of devices. As power dissipation rises, the inability to cool them may force designers to de-rate the devices’ performance by reducing current or switching speed and/or employing higher-voltage devices that are less efficient and … [Read more...]

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