Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
Arieca Announces an Agreement to Develop a Liquid-Metal-Based Thermal Interface Material for Power Modules in the Electric Vehicle (xEV) Segment
May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca, a leader in liquid-metal-based Thermal Interface Materials (TIM), entered into a joint research agreement with ROHM Co., Ltd., a leading provider of power semiconductor devices for the xEV market, to develop next-generation TIM using Arieca’s Liquid Metal Embedded Elastomer(LMEE) Technology. This … [Read more...]
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
Osaka, Japan - Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of … [Read more...]
Fan Cooling – Part 1: Determining Flow Rate
Authored by Ross Wilcoxon and Genevieve Martin Associate Technical Editors for Electronics Cooling For a number of reasons, including cost, simplicity, power consumption, noise, etc., natural convection is the preferred approach for cooling electronic systems. However, it is often the case that natural convection is simply not sufficient to remove dissipated power … [Read more...]
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