Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of excellence” designation is a new indicator within Sapa’s thermal management business unit that will provide “dedicated thermal management … [Read more...]
High-Performance Heat Sinks for Challenging Microprocessor Cooling Applications
Thermal solutions company Thermacore, Inc. has released a new product line of compact, high-performance air-cooled heat sinks. According to the company, the new generation of heat sinks is the result of a multimillion-dollar development contract from the Defence Advanced Research Projects Agency (DARPA). As part of the DARPA Micro-Technologies for Air-Cooled Exchangers (MACE) … [Read more...]
Thermal Management Compound for LED Heat Sinks
PolyOne Corporation reports that Finland-based LED lighting systems maker Kruunutekniikka Oy has chosen its Therma-Tech thermal management compounds to replace aluminum in the lighting systems maker’s Coolics LED light fixtures. Aluminum is the traditional material for many LED heat sink applications. According to Holger Kronimus, general manager of the PolyOne Corporation’s … [Read more...]
Polycarbonate Replaces Aluminum in Cooling Elements for LED Thermal Management
With the demand for polycarbonate for the production of LED lighting systems growing, Bayer MaterialScience has been steadily expanding its product range to include injection molding and extrusion granules as well as semi-finished film and sheet products. The latest list of company product developments includes polycarbonates with particularly high thermal conductivity for … [Read more...]
Thermally Conductive Epoxy System for Bonding Heat Sinks in Electronic Assemblies
Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies. Aremco-Bond™ 860 is comprised of a ratio of one-part base resin to one-part activator by weight and can be used for … [Read more...]
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