In the Tech Data series on thermal conductivity, gases - especially air - have been the subject of a few contributions. So far, the influence of two important parameters has been covered: temperature and pressure. However, people regularly ask: "What exactly is the influence of humidity?" And my standard answer has always been: "Nothing to worry about." Some time ago, one of … [Read more...]
Thermal Interface Materials
It doesn't take long for an electronics assembler to realize that a thermal interface material (TIM) is essential when two or more solid surfaces are in the heat path. Standard machined surfaces are rough and wavy, leading to relatively few actual contact points between surfaces. The insulating air gaps created by multiple voids of "contacting" hard surfaces are simply too … [Read more...]
Cooling Technology Options, Part 2
(Editor's Note: Part 1 of this article appeared in the August 2003 issue of ElectronicsCooling. Illustration references in this part begin with Figure 5.) Cooling electronic systems is one of the major focal points of the design process and the key to a successful product launch. Many options to attain successful operation are available, ranging from passive cooling to … [Read more...]
Prediction of Thermal Contact Resistance
All engineering surfaces exhibit some level of microscopic roughness. The resistance to heat flow through a contact interface occurs because only a small portion (usually 1-2%) [1] of the nominal surface area is actually in contact. Heat may pass through the interface via three paths: conduction through the contact spots, conduction through the gas present in the gap between … [Read more...]
Calculations for Thermal Interface Materials
It's no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the importance of thermal interface materials (TIMs) as a key factor in determining the thermal performance of packages intended for high-power applications. This … [Read more...]
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