"The stuff you engineers design is too good," the guy from Marketing said, "I need shoddier! Can you make them less efficient and cheaper?" I was working for a small company that made electric power conditioning equipment. Our devices protected against spikes, sags and brownouts in the AC power for mission-critical equipment like air traffic control radar and the computer … [Read more...]
Managing power requirements in the electronics industry
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access - coupled with expanding needs for all modes of electronic communications - have resulted in telecommunications systems that exhibit dramatic increases in power … [Read more...]
Low temperature electronic cooling
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
High accuracy thermal interface resistance measurement using a transient method
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
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