(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
Laser Storage in Data Centers Could Mean Less Heating
(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling. “A way to store information in a particularly tiny area is by taking advantage of the fact that individual electrons possess magnetization, which is called … [Read more...]
Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers
Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up to 340 watts, which is ideal for larger cooling applications with limited surface area such as industrial lasers,” claimed Laird. It also has a “precise … [Read more...]
Push for Better Industrial Enclosures Cooling
(May 18, 2016) As the heat produced by electronic components continues to increase, suggestions are made to push for improvement on better managing industrial enclosure temperatures. “Relative to each individual component, the heat of electronic components has increased significantly in recent years,” reported ECNMag.com, “At the same time, the density inside control cabinets … [Read more...]
Researchers May Have Solved the Problem of Thermal Resistance for ICs
(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers and associated monolithic microwave ICs (MMICs) which are increasingly used in RF designs. GaN offer many operating … [Read more...]
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