Modern data centers require advanced cooling solutions to operate at peak performance. As one of the most rapidly growing industries in the world, data centers are changing how we develop new cooling technology at a record pace. The data center market is projected to continue growing by 8.5% per year over the next five years, to over $600 billion by 2029.* Artificial … [Read more...]
Airsys Introduces the PowerOne™ AI-Era Cooling Solutions for Modern Data Centers
As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
Sheetak Strengthens U.S. Thermoelectric Manufacturing with Custom Solutions and Rapid Prototyping
Custom thermoelectric devices, faster prototypes, and reliable U.S. manufacturing for critical industries. Sheetak Inc., a U.S.-based leader in advanced thermoelectrics, is redefining solid-state cooling and energy management with fully customizable devices and rapid prototyping through its expanded U.S. manufacturing capabilities. Headquartered in Austin, Texas, Sheetak … [Read more...]
NEW PRODUCT: Protect Sensitive Electronics in Explosive Environments with New Aluminum ATEX Cabinet Cooler Systems
EXAIR’s ATEX Cabinet Cooler® Systems deliver a powerful and affordable solution for keeping electrical enclosures cool in hazardous ATEX classified areas—and they’re now available in durable aluminum construction. Engineered for use in Zones 2 and 22, these coolers are UL tested, CE compliant, and meet stringent ATEX standards for purged and pressurized enclosures. With … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
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