In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
Surging IT & Telecom Industry to Promote Data Center Cooling Market Growth
New technological innovations have led to increase in number of data centers across the globe which in turn has resulted in heavy demand for data center cooling systems. According to Global Market Insights, Inc., “Data Center Cooling market share worth USD 2.5 billion in 2015, is anticipated to exceed USD 6 billion by 2023, recording a CAGR of 11% over 2016-2023.” Rising need … [Read more...]
Thermal Management of Outdoor Enclosures, Part 3: Semi-Active Cooling Systems
In Part 1 (Thermal Management of Outdoor Enclosures), key aspects for successful design and development of thermal management systems were covered briefly, among these, cooling device selections and its impact on power, battery back-up and maintenance has therefore become of paramount importance for telecommunications enclosures. These are: Full active systems, like air … [Read more...]
Rosenberg Releases RoVent 10, New Generation Of Fan Selection Software
The latest version of Rosenberg’s RoVent fan selection software, RoVent 10, is now available for download at no cost from the Rosenberg USA Web site, http://www.rosenbergusa.com. RoVent 10 delivers fast operating point-accurate selection of more than 2,900 fan models based on user parameters. It also provides users the capability to configure Rosenberg ECFanGrid … [Read more...]
DegreeC Board-Solderable Air Velocity Sensors, Now With 5V Operation
Since the initial release of our F660 and F661 board mount sensors in 2017, we have received numerous requests for a 5V package. The F660 and F661 have answered the need for both low and tall profile sensors with the smallest possible footprint, and for very high volume applications - a reference circuit design where we supply only the sensor head, and a 4mm x 4mm x 0.9mm … [Read more...]
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