The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete parts of the interface. Therefore, the actual contact area of pressed surfaces represents a very small fraction of the … [Read more...]
Dynamic Measurements: A Cornerstone of the European PROFIT Project
This article presents an overview of a number of dynamic measurement methods as part of the European PROFIT project. Due to lack of space, details cannot be given, but the interested reader is invited to consult the references at the end of the article. Because the majority of a product's cost and performance are committed in the early phases of a design cycle, it is envisioned … [Read more...]
Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures
Today it is commonly accepted that dynamic thermal measurements, which have been used for more than 20 years [1], [2], [3], [4], are superior to steady-state ones. The temperature vs. time function - often called the thermal step-response function, heating curve, or thermal impedance curve - is characteristic of the chip-to-ambient structure, including even different cooling … [Read more...]
Estimating Temperatures in a Water-to-Air Hybrid Cooling System
As most readers are no doubt aware, the trend towards ever increasing processor module power is making it more and more difficult to cool directly with air. Many thermal engineers are convinced that water cooling may be the answer. This does not necessarily mean that cooling water must be supplied by the customer. Instead, in some instances it may be possible to use a … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
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