Thermoelectric temperature control systems are being used in an increasingnumber of applications. Typical applications of these systems are in thermalregulation of electronic enclosures, recirculating chillers for laser cooling,semiconductor process control and management of patient hypo- and hyperthermia. Thermoelectric coolers (TECs) are essentially solid state devices that … [Read more...]
A valve-less fluid pump for electronic cooling
In a research project at the Royal Institute of Technology we have developeda pump based on a new fluid pump principle with no valves. The pump consists oftwo fluid flow rectifying diffuser/nozzle elements which are connected to theinlet and outlet of a pump chamber with an oscillating pump diaphragm, as shownin Fig.1. The diffuser/nozzle element has a lower flow resistance in … [Read more...]
Applying computational fluid dynamics to heat sink design and selection
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on approximations and correlations; and experimental work. Whether theapplication includes single or multiple heat sinks, the … [Read more...]
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development and experimental validation of thermal models of avariety of `generic' electronic parts. DELPHI (which stands for … [Read more...]
Electronic package characterization per JEDEC standard
Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The junction temperature of a chip directly affectsthe performance of the circuits and the reliability of … [Read more...]