Figure 1. Ceramic Package - Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today's high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks are a commonly-used, low cost means of increasing theeffective surface area for dissipating heat by means of convective air cooling.While … [Read more...]
Thermal Interface Materials
Thermattach thermally conductive adhesivetapes Introduction Today's semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power devices,namely 10 to 25 watts. These power levels require thermal management techniquesinvolving large … [Read more...]
Applying computational fluid dynamics to heat sink design and selection
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on approximations and correlations; and experimental work. Whether theapplication includes single or multiple heat sinks, the … [Read more...]
How to Select a Heat Sink
With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the … [Read more...]
