Easy-to-use, dependable chillers offer application-specific configurability for precise temperature control of industrial and analytical equipment… December 13, 2021 – Laird Thermal Systems expands the Nextreme™ family with the Value Chiller Series of recirculating chillers for equipment manufacturers seeking a reliable yet cost-effective cooling solution. The Value line … [Read more...]
Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip’s Data Center Solutions SoC Development
Palladium Z2 Emulation enabled Microchip to achieve 1.5X faster run-time performance and 2X better emulation capacity SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Microchip has deployed the Cadence® Palladium® Z2 Enterprise Emulation Platform for the development of their next generation ASIC products targeting high performance and … [Read more...]
Bosch and Volkswagen Want to Industrialize Factory Equipment for Battery-Cell Production
Bosch and Volkswagen want to industrialize factory equipment for battery-cell production Bosch and Volkswagen aim to achieve cost and technology leadership in industrial-scale manufacturing processes for battery cells. Partners plan to provide state-of the-art manufacturing systems, digitalization solutions, as well as ramp-up and maintenance … [Read more...]
Panasonic Commercializes a Surface Mounted Automotive Power Communication Networking Equipment Inductor Capable of Passing Large Currents
Surface mounted inductors with a rated current of 30 to 70 A contribute to the enhanced performance and downsizing of automotive ECUs Osaka, Japan – Panasonic Corporation announced today that its Industry Company has commercialized a low-loss and high vibration-resistant surface mounted automotive power inductor [1] (PCC-M15A0MF series). This 15.6 mm square inductor meets … [Read more...]
A Polyimide Single-Component Silver Filled, Electrically Conductive Semiconductor Die-Attach Adhesive
Creative Materials introduces 122-47, a polyimide single-component silver filled, electrically conductive semiconductor die-attach adhesive. This product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface mount applications. Other applications include assembling electrical and electronic components. The … [Read more...]
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