Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld products is one of the biggest challenges facing device designers today,” Jonathan Rowntree, vice president of … [Read more...]
New Low Viscosity, Thermally-Conductive Silicone Potting Elastomer
NuSil Technology, a manufacturer of silicone materials for the medical, aerospace, electronics and engineering markets, has released R-2165, a new silicone solution for the protection of electronic components and systems such as sensors, relays and connectors. “R-2165 is the latest addition to NuSil’s diverse portfolio of silicones designed for potting and encapsulating … [Read more...]
Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation
NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations. According to the company, the new bearing features “an optimized grease that does not easily break down . . . thus preventing … [Read more...]
High Power, High Efficiency Cooling Fans and Impellers
NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in the medical and industrial field. The new R and F Series of high power cooling fans achieve better airflow performance and efficiency due to a new … [Read more...]
Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates
The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air to carry the heat away from the chip, and reject it to the ambient. Air cooled heat sinks are the most commonly used air-cooling devices with … [Read more...]
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