Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used to remove the excess heat. For the thermal engineer, fan-less cooling is more problematic. On the plus side, no fan is needed, so there is an attractive cost … [Read more...]
Change and Communication
We live in an age of change. Of course this is not new, the history of the human race has been one of change and adaptation throughout the ages. However, it seems that never before has the pace of change been so swift. Throughout the ages, this has been especially true with regards to how we communicate with each other. Our earliest ancestors on the savannas of Africa, in the … [Read more...]
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field and assume that the components of a system have inherent constant failure rates that are … [Read more...]
LED Thermal Standardization: A Hot Topic
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
- « Previous Page
- 1
- …
- 37
- 38
- 39
- 40
- 41
- …
- 44
- Next Page »
