Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
“Golf Ball Dimple” Cooling Fans Added to Distribution Portfolio
Luso Electronics, a distributor of thermal management products, has announced the addition of Zaward Corporation’s patented “Golf Fan” products for thermal management in computing and industrial applications. According to Luso Electronics, the design for the new fans is based on “the dimpled surface of a golf ball” and “shows improved airflow and low noise at the same rotating … [Read more...]
New High-Efficiency Thermoelectric Air Conditioner
TECA Corporation has introduced the AHP-6200 family of thermoelectric air conditioners. The AHP-6200 air conditioners provide cooling performance up to 5,200 BTU/hr in the 240 VAC configurations. Each system includes TECA’s Eco-Mode temperature control design that limits active cooling when not needed, reducing total power consumption by up to 75 percent. The AHP-6200 air … [Read more...]
High Power, High Efficiency Cooling Fans and Impellers
NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in the medical and industrial field. The new R and F Series of high power cooling fans achieve better airflow performance and efficiency due to a new … [Read more...]
Changes in Surface Texture Double Heat Dissipation
Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
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