The pace of development in the electronics and telecommunication fields has been accelerating in all aspects of the business. For example, electronics/telecommunications equipment has traditionally been housed in large buildings, smaller buildings (sheds) and outdoor cabinets. The introduction of the electronics to the outside has imposed serious constraints on enclosure design … [Read more...]
The Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-dimensional, Conjugate Heat Transfer World
INTRODUCTION As integrated circuits were becoming more widespread in the 1980’s, most of the developmental problems had to do the with electrical operation of the devices and not so much on cooling them, due to low power levels. It was the electrical engineers who did the functional testing, an activity that ultimately expanded to include thermal testing. Even the thermal … [Read more...]
Strategies for Using Thermal Calculation Methods
Thermal analysis tools available to engineers and scientists offer a wide variety of methods to solve problems. A cursory review of the past decade’s issues of Electronics Cooling magazine can show methods ranging from analytical techniques (such as hand calculations) to spreadsheets to full numerical/computational solutions such as CFD (Computational Fluid Dynamics) and FEA … [Read more...]
Developing a Thetajc Standard Under Steady-State Testing Conditions
ABSTRACT Testing standards provide a common framework for collecting and reporting data. Without a clearly defined testing standard, it is impossible to compare experimental data measured by different labs since differing test conditions may mask the very effect being tested. For this reason, a Thetajc standard is needed to specify testing conditions that allow for an … [Read more...]
Use of the Monte Carlo Method in Packaging Thermal Calculations
INTRODUCTION The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of a packaging or an active cooling component depends on the quality of the data characterizing these various components. In the real world of manufacturing, such characterization … [Read more...]
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