The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according to new research from scientists at the University of Manchester, UK and the University of California-Riverside, U.S. The phenomenon was … [Read more...]
Magnetically-Stimulated Flow Patterns Could Boost Heat Transfer
Magnetically-stimulated fluid flow patterns may offer a new method for handling difficult heat transfer problems by overcoming natural convection limits, according to new research from scientists at Sandia National Laboratories. Convection cooling, which refers to the transfer of heat between two places by the movement of fluids, is often forced in many modern cooling systems … [Read more...]
Nanoscale Pillars May Improve Thermoelectric Materials
Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste heat from power plants into electricity. The technique, which involves constructing an array of nanoscale pillars on top of a sheet of … [Read more...]
Researchers Eye Passive Cooling System for Microelectronics
Researchers at San Diego State University in California are examining an alternative to traditional heat pipes they say could help increase cooling efficiency in laptops and other portable electronic devices. Known as pulsating or oscillating heat pipes, the system may offer a heat transfer capacity up to 100 times better than conventional heat pipes, says assistant professor … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
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