With solar energy systems growing in popularity and adoption across the globe, methods for enhancing the efficiency and power density of solar cells are a hot topic for renewable energy research labs. Essentially all photovoltaic technologies currently available suffer from reduced efficiency when operating at higher than nominal temperatures. In an attempt to reduce the … [Read more...]
Rising Demand for Thermal Management in Consumer Electronics Prime Factor for Exponential Growth of Market
According to the new market research report "Thermal Management Market by Material Type (Adhesive, Non-Adhesive), Devices (Conduction, Convection, Advanced, Hybrid), Service (Installation & Calibration, Optimization & Post Sales), End-Use Application - Global Forecast to 2022", The thermal management market is expected to be worth USD 14.24 Billion by 2022, growing at a … [Read more...]
New Thermoelectric Controllers for Precise Temperature Control
European Thermodynamics are pleased to announce the launch of the new JUNIOR and CyCLO pulse width modulator (PWM) thermoelectric controller electronic PCBs. Developed to work with the Adaptive® thermoelectric assemblies and thermoelectric cooler (TEC) modules, JUNIOR and CyCLO are thermoelectric controllers that enable a precise method of temperature control for sensitive … [Read more...]
New Heat Exchange Module Launched
CoolIT Systems (CoolIT), world leader in energy efficient liquid cooling solutions for HPC, Cloud, and Enterprise markets, has expanded its Rack DCLC™ product line with the release of the AHx2 Heat Exchange Module. This compact Liquid-to-Air heat exchanger makes it possible for Direct Contact Liquid Cooling (DCLC) enabled servers to be thermally tested during the factory … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
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