Excelsys has recently announced the development of its CoolX600, a fan-less modular 600W power supply that is 215 x 115 x 40mm (8.5 x 4.5inch x 1U). CoolX600 can be populated with up to four ‘CoolMod’ output modules, providing up to four isolated DC outputs ranging from 2.5V to 58V. Higher input surge protection is 4kV line-to-PE for harsh environments, and there is reverse … [Read more...]
New Speed Controllers for Fans to Reduce Energy Consumption
Orion Fans has recently developed a low-cost dual channel phase control unit to control fan speed for single or multiple fan assemblies, series OA11/22. It is field adjustable, with the ability to precisely control fan noise, speed, and air delivery according to application requirements. It also comes with four factory presets that allow for maximum flexibility with minimum … [Read more...]
Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers
Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up to 340 watts, which is ideal for larger cooling applications with limited surface area such as industrial lasers,” claimed Laird. It also has a “precise … [Read more...]
New Availability of Data Matrix Codes (DMCs)
Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by code-reading camera systems” and “are written on metalized surfaces by means of a thin oxide layer formed by an optical laser system,” said the … [Read more...]
New Material Cools Solar Cells Yet Absorbs Sunlight
Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered holes, about 6 micrometers across and 10 micrometers deep, in the wafer. The holes are designed to smooth the … [Read more...]
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